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SNJ54LS74AFK

Texas Instruments

SNJ54LS74AFK by Texas Instruments

SNJ54LS74AFK by Texas Instruments is a TTL technology chip carrier with 2 functions, 40 ns propagation delay, and 15 pF load capacitance. It operates at a supply voltage of 5V and has a max frequency of 25 MHz. Ideal for military applications requiring positive edge trigger latches & flip-flops in harsh environments.

Median Price

$12.416

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 355 parts In-Stock

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$12.416

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Vyrian

USA . 4,167 parts In-Stock

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Beltway Electronics Company

USA . 50 parts In-Stock

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Electronic Expediters

USA . 15 parts In-Stock

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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Electronics Depot

USA . 7 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 5 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Resion

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,944 parts In-Stock

1+ parts

$11.763

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Parana Technologies

USA . 1,186 parts In-Stock

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$19.436

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$19.448

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$19.436

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DigiPath Technology Company

USA . 1,314 parts In-Stock

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$21.401

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ChromeModa Solutions

Germany . 6,856 parts In-Stock

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$21.838

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$17.907

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$21.838

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IDEA Electronic Components Group

UK . 18 parts In-Stock

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$21.838

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$20.746

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$19.654

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$21.838

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Enhance your electronic projects with the SNJ54LS74AFK from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This latches & flip-flops device offers reliable performance and versatility, suitable for various applications. With its fast propagation delay and military-grade screening level, this chip carrier package ensures exceptional functionality in extreme conditions. Upgrade your designs with the dependable technology of the SNJ54LS74AFK and experience superior results that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 40 ns

Fast propagation delay ensures quick response times in signal processing applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

No. of Functions: 2

Multiple functions in one component can simplify circuit design and reduce overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ideal for applications where heat resistance is important.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of events in digital circuits.

Technology: TTL

TTL technology provides reliable and fast digital signal processing capabilities.

Technical Specifications

Latches & Flip-Flops SNJ54LS74AFK attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54LS74AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-193-5821, 5962011935821, 5962-01-228-0142, 5962012280142, 5962-01-324-5930, 5962013245930

NIIN

011935821, 012280142, 013245930

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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