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SNJ54LS374FK

Texas Instruments

SNJ54LS374FK by Texas Instruments

SNJ54LS374FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 28ns. It operates at a nominal voltage of 5V and has a max power supply current of 40mA. This chip is ideal for military-grade applications requiring true output polarity and positive edge triggering in a compact chip carrier package.

Median Price

$26.188

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$20.950

1k+ parts

$18.740

10k+ parts

$17.640

356

-

$20.950

$18.740

$17.640

DigiKey

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$27.560

1k+ parts

-

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356

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$27.560

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Verical

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$26.188

1k+ parts

$23.425

10k+ parts

$22.050

356

-

$26.188

$23.425

$22.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ace Electronics

USA . 4 parts In-Stock

1+ parts

$10.000

100+ parts

-

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4

$10.000

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$13.492

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15

$13.492

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American Microsemiconductor Inc.

USA . 10 parts In-Stock

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$13.890

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-

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10

$13.890

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Digiode

USA . 4,003 parts In-Stock

1+ parts

$18.668

100+ parts

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4,003

$18.668

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Vyrian

USA . 7,037 parts In-Stock

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7,037

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Electronics Depot

USA . 109 parts In-Stock

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109

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ECAB

Sweden . 48 parts In-Stock

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48

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Mil-Aero Solutions, Inc.

USA . 9 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,609 parts In-Stock

1+ parts

$2.416

100+ parts

-

1k+ parts

$2.319

10k+ parts

$2.319

4,609

$2.416

-

$2.319

$2.319

Netroflash

USA . 50 parts In-Stock

1+ parts

$13.492

100+ parts

$13.222

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50

$13.492

$13.222

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Ampacity Inc.

Singapore . 356 parts In-Stock

1+ parts

$15.100

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356

$15.100

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Corphita

USA . 4,717 parts In-Stock

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$17.685

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$17.685

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Parana Technologies

USA . 1,220 parts In-Stock

1+ parts

$23.318

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$23.959

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1,220

$23.318

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$23.959

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DigiPath Technology Company

USA . 1,970 parts In-Stock

1+ parts

$25.676

100+ parts

$23.622

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1,970

$25.676

$23.622

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ChromeModa Solutions

Germany . 3,548 parts In-Stock

1+ parts

$26.200

100+ parts

$21.484

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3,548

$26.200

$21.484

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IDEA Electronic Components Group

UK . 2,062 parts In-Stock

1+ parts

$26.200

100+ parts

$24.890

1k+ parts

$23.580

10k+ parts

-

2,062

$26.200

$24.890

$23.580

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Overview

Enhance your electronic designs with the reliable SNJ54LS374FK bus driver and transceiver from Texas Instruments. Crafted with high-quality ceramic and metal-sealed cofired materials, this 8-bit chip carrier offers a fast propagation delay of 28 ns for seamless signal transmission. Ideal for military-grade applications, this true output polarity device features a 3-STATE configuration and positive edge trigger type. Experience the exceptional value and performance of Texas Instruments products with the SNJ54LS374FK, providing customers with top-notch quality and reliability for all their circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection, ensuring the reliability and longevity of the product.

Propagation Delay At Nominal Supply: 28 ns

Fast propagation delay ensures quick response times and efficient communication in bus driving applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient use of PCB space.

No. of Bits: 8

Suitable for applications requiring 8-bit data transmission and processing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Common supply voltage, compatible with many systems and easy to integrate.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the product to function reliably in various environments.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling better control and flexibility in bus driver applications.

Technology: TTL

TTL technology provides high speed and reliable communication for efficient bus driving tasks.

Technical Specifications

Bus Driver & Transceivers SNJ54LS374FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54LS374FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-272-8231, 5962012728231, 5962-01-316-8162, 5962013168162

NIIN

012728231, 013168162

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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