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SNJ54LS257BW

Texas Instruments

SNJ54LS257BW by Texas Instruments

SNJ54LS257BW by Texas Instruments is a 4-function multiplexer with 2 inputs and 2 bits. It operates at a nominal voltage of 5V, with a propagation delay of 21ns. Ideal for military-grade applications due to its MIL-PRF-38535 screening level and TTL technology.

Median Price

$17.342

Lifecycle Status

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7

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1k+

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Chip1Stop

Japan . 73 parts In-Stock

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Vyrian

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Digiode

USA . 1,507 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 591 parts In-Stock

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Electronic Expediters

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Electro Mavin

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Sunrise Surplus Inc.

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AZTECH Wire

Italy . 696 parts In-Stock

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Parana Technologies

USA . 1,809 parts In-Stock

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IDEA Electronic Components Group

UK . 82 parts In-Stock

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ChromeModa Solutions

Germany . 25 parts In-Stock

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Corphita

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Microchip USA

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DigiPath Technology Company

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Overview

Upgrade your electronic designs with the high-quality SNJ54LS257BW multiplexer & demultiplexer from Texas Instruments. With a MIL-PRF-38535 screening level and a durable ceramic, glass-sealed package body material, this versatile component is perfect for military-grade applications. Offering 3-STATE output characteristics and a fast propagation delay of just 21 ns at nominal supply, this product ensures efficient performance. Trust in the reliability, precision, and innovation that Texas Instruments delivers, and take your projects to the next level with the SNJ54LS257BW.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and protection for the internal components, making this product suitable for harsh environments.

Propagation Delay At Nominal Supply: 21 ns

The low propagation delay ensures fast and efficient signal processing, making this multiplexer/demultiplexer ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, allowing for efficient PCB assembly and space-saving design.

No. of Functions: 4

Having 4 functions in one device maximizes functionality and can help reduce the overall component count in a circuit, saving cost and board space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies power requirements and compatibility with other components in the system.

Output Characteristics: 3-STATE

The 3-state output feature allows the outputs to assume a high-impedance state which can help prevent bus contention issues and enable more flexible interfacing.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this multiplexer/demultiplexer ensures reliability and performance in extreme temperature and environmental conditions.

Technology: TTL

Using TTL technology provides compatibility with existing TTL logic systems, ensuring seamless integration and reliable operation in digital circuits.

Technical Specifications

Multiplexer & Demultiplexer SNJ54LS257BW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.2 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

18 mA

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SNJ54LS257BW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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