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SNJ54LS05W

Texas Instruments

SNJ54LS05W by Texas Instruments

SNJ54LS05W by Texas Instruments is a TTL logic gate with 6 functions, 32 ns propagation delay at 5V. It has open-collector output and operates in military temperature grade applications. This ceramic, glass-sealed package is surface mountable and has a max power supply current of 6.6 mA.

Median Price

$26.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$26.660

1k+ parts

$23.850

10k+ parts

$22.450

21

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$26.660

$23.850

$22.450

DigiKey

USA . 21 parts In-Stock

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Freelance Electronics

USA . 24 parts In-Stock

1+ parts

$17.394

100+ parts

$18.264

1k+ parts

$17.220

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24

$17.394

$18.264

$17.220

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Digiode

USA . 4,025 parts In-Stock

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$24.472

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$24.472

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Vyrian

USA . 5,125 parts In-Stock

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Electronic Expediters

USA . 11 parts In-Stock

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First Choice Components Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,172 parts In-Stock

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$23.184

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3,172

$23.184

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Parana Technologies

USA . 722 parts In-Stock

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$26.184

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$26.773

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722

$26.184

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IDEA Electronic Components Group

UK . 1,572 parts In-Stock

1+ parts

$29.420

100+ parts

$27.949

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$26.478

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ChromeModa Solutions

Germany . 373 parts In-Stock

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$29.420

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$24.124

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Microchip USA

USA . 1,098 parts In-Stock

1+ parts

$53.750

100+ parts

$52.820

1k+ parts

$52.350

10k+ parts

$51.880

1,098

$53.750

$52.820

$52.350

$51.880

DigiPath Technology Company

USA . 2,307 parts In-Stock

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$26.525

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Overview

Enhance your electronics projects with the high-quality SNJ54LS05W logic gates from Texas Instruments. Known for their reliability and superior performance, Texas Instruments products are trusted by professionals worldwide. Ideal for a wide range of applications, these logic gates offer fast propagation delays and low power consumption, making them perfect for demanding military-grade projects. Upgrade your designs with the efficiency and precision that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components of the logic gates, ensuring reliable performance in various environments.

Propagation Delay At Nominal Supply: 32 ns

The low propagation delay at nominal supply voltage of 5V ensures fast signal processing and response times, making this product suitable for high-speed applications.

Surface Mount: YES

The surface-mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 6

Having 6 functions in a single device increases efficiency and reduces the need for multiple components, resulting in a more compact and cost-effective solution.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions, making this product suitable for a wide range of applications.

Technology: TTL

The TTL technology used in these logic gates provides high-speed operation and compatibility with TTL logic levels, making them a versatile choice for a variety of digital circuits.

Technical Specifications

Logic Gates SNJ54LS05W attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

6.6 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.285 mm

Trade Compliance

SNJ54LS05W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-158-9909, 5962011589909, 5962-01-249-8050, 5962012498050

NIIN

011589909, 012498050

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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