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SNJ54HC112W

Texas Instruments

SNJ54HC112W by Texas Instruments

SNJ54HC112W by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 41ns propagation delay, and 185ns tpd. It operates at a supply voltage of 5V and has a max frequency of 17MHz. Ideal for military applications due to MIL-PRF-38535 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,592 parts In-Stock

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Digiode

USA . 2,861 parts In-Stock

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AZTECH Wire

Italy . 728 parts In-Stock

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$6.180

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728

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Parana Technologies

USA . 605 parts In-Stock

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$11.080

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$11.538

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One Stop Electronics

USA . 1,648 parts In-Stock

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$12.000

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DigiPath Technology Company

USA . 1,336 parts In-Stock

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$12.200

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ChromeModa Solutions

Germany . 4,462 parts In-Stock

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$12.449

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$10.208

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IDEA Electronic Components Group

UK . 1,640 parts In-Stock

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$12.449

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$11.827

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$11.204

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$12.449

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Ampacity Inc.

Singapore . 399 parts In-Stock

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$57.000

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Corphita

USA . 2,420 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the SNJ54HC112W by Texas Instruments, a top-of-the-line latches & flip-flops component that guarantees reliability and exceptional performance. Crafted with precision using high-quality materials, this product offers unparalleled value and versatility for a wide range of applications. Let Texas Instruments be your trusted partner in creating innovative solutions with cutting-edge technology. Experience the difference with SNJ54HC112W and unleash the full potential of your projects today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and protection for the latch, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 41 ns

The low propagation delay of 41 ns ensures fast response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier, saves space, and allows for automated assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most systems and reduces the need for additional power conversion.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch can withstand elevated temperatures, making it suitable for a wide range of environments.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type ensures reliable and precise operation, enhancing the overall performance of the latch.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making this latch an efficient choice for electronic circuits.

Technical Specifications

Latches & Flip-Flops SNJ54HC112W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

17000000 Hz

Maximum I (ol):

-4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

185 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

6.73 mm

Minimum fmax:

20 MHz

Trade Compliance

SNJ54HC112W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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