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SNJ54AHC74W

Texas Instruments

SNJ54AHC74W by Texas Instruments

SNJ54AHC74W by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 10.5 ns propagation delay, and 3.3V nominal voltage. It is MILITARY grade suitable for applications requiring positive edge trigger at temperatures ranging from -55 to 125 °C. This rectangular flatpack package has a max frequency of 75 MHz and operates on power supplies b/w 2-5.5V, making it ideal for high-speed digital circuits in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,469 parts In-Stock

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Resion

USA . 54 parts In-Stock

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54

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 786 parts In-Stock

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$16.522

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786

$16.522

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Parana Technologies

USA . 509 parts In-Stock

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$20.644

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$20.752

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509

$20.644

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$20.752

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DigiPath Technology Company

USA . 881 parts In-Stock

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$22.731

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$20.913

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881

$22.731

$20.913

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ChromeModa Solutions

Germany . 5,104 parts In-Stock

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$23.195

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$19.020

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$23.195

$19.020

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

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$23.195

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$22.035

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$20.876

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One Stop Electronics

USA . 856 parts In-Stock

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$31.000

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856

$31.000

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Ampacity Inc.

Singapore . 1,385 parts In-Stock

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$53.000

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Microchip USA

USA . 2,198 parts In-Stock

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Corphita

USA . 1,297 parts In-Stock

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Overview

Experience top-notch quality and reliability with the Texas Instruments SNJ54AHC74W latches & flip-flops. This product, manufactured by a trusted industry leader, offers customers unmatched value and benefits. Ideal for a variety of applications, this versatile component ensures high-performance results. Upgrade your projects with the SNJ54AHC74W and enjoy the advantages it brings to the table!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the latches & flip-flops, making them suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

With a low propagation delay, these latches & flip-flops offer fast response times, enabling efficient operation in time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 3.3

The specified nominal supply voltage of 3.3V ensures compatibility with common power supply systems, making integration easier.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows these latches & flip-flops to function reliably in harsh environmental conditions.

Technology: CMOS

Utilizing CMOS technology, these latches & flip-flops offer low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Latches & Flip-Flops SNJ54AHC74W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.285 mm

Minimum fmax:

110 MHz

Trade Compliance

SNJ54AHC74W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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