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SNJ54AHC74FK

Texas Instruments

SNJ54AHC74FK by Texas Instruments

SNJ54AHC74FK by Texas Instruments is a CMOS latches & flip-flops chip with 2 functions, 10.5 ns propagation delay, and 3.3V nominal voltage. It is ideal for military applications due to its MIL-PRF-38535 screening level and operates b/w -55°C to 125°C temperature range. The chip comes in a square ceramic package with metal-sealed cofired body material and has a max frequency of 75 MHz at nominal supply.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,759 parts In-Stock

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4,759

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Digiode

USA . 4,259 parts In-Stock

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4,259

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 174 parts In-Stock

1+ parts

$16.820

100+ parts

-

1k+ parts

$17.065

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174

$16.820

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$17.065

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AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$17.563

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808

$17.563

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DigiPath Technology Company

USA . 1,902 parts In-Stock

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$18.521

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1,902

$18.521

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ChromeModa Solutions

Germany . 2,385 parts In-Stock

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$18.899

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$15.497

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2,385

$18.899

$15.497

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IDEA Electronic Components Group

UK . 1,615 parts In-Stock

1+ parts

$18.899

100+ parts

$17.954

1k+ parts

$17.009

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1,615

$18.899

$17.954

$17.009

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One Stop Electronics

USA . 571 parts In-Stock

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$35.000

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571

$35.000

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Corphita

USA . 4,309 parts In-Stock

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4,309

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Microchip USA

USA . 2,012 parts In-Stock

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Overview

Discover the high-quality SNJ54AHC74FK by Texas Instruments, a top-tier manufacturer of electronics. This versatile latches & flip-flops category product offers fast 10.5 ns propagation delay and a wide operating temperature range from -55°C to 125°C. With MIL-PRF-38535 screening level and low power consumption, this chip carrier package is perfect for military-grade applications. Experience the value and reliability of Texas Instruments with this efficient and durable component that meets all your circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high reliability and performance, making the product suitable for critical applications.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient operation of the latch or flip-flop, making it ideal for high-speed applications.

Surface Mount: YES

Surface mounting capability allows for easy and secure installation on PCBs.

Nominal Supply Voltage / Vsup: 3.3 V

Operates at a common and stable supply voltage, making it compatible with a wide range of systems.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, ensuring durability and reliability in harsh environmental conditions.

Technical Specifications

Latches & Flip-Flops SNJ54AHC74FK attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

110 MHz

Trade Compliance

SNJ54AHC74FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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