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SNJ54AC74W

Texas Instruments

SNJ54AC74W by Texas Instruments

SNJ54AC74W by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 17.5 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage of 3V, has a max frequency of 70 MHz, and is MILITARY grade suitable for applications requiring positive edge trigger type in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,353 parts In-Stock

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Digiode

USA . 791 parts In-Stock

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Bristol Electronics

USA . 146 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 797 parts In-Stock

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$14.119

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Parana Technologies

USA . 2,306 parts In-Stock

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$21.599

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ChromeModa Solutions

Germany . 2,848 parts In-Stock

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$24.269

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$19.901

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

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$24.269

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$23.056

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$21.842

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One Stop Electronics

USA . 962 parts In-Stock

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$32.000

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Lixinc

USA . 3,394 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 2,340 parts In-Stock

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DigiPath Technology Company

USA . 1,874 parts In-Stock

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Corphita

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Overview

Elevate your electronics projects with the SNJ54AC74W by Texas Instruments, a high-quality latches & flip-flops component that promises reliability and precision. With a MILITARY-grade screening level and a maximum frequency of 70 MHz, you can trust in the superior performance of this product. Whether you're working on military applications or consumer electronics, the SNJ54AC74W delivers unmatched value and efficiency. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durable and reliable packaging for long-term use.

Propagation Delay At Nominal Supply: 17.5 ns

Fast propagation delay ensures quick response time in circuit operations.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for efficient power consumption.

Maximum Operating Temperature: 125 °C

Allows for reliable operation even in high-temperature environments.

Trigger Type: POSITIVE EDGE

Specific trigger type for efficient signal processing and timing control.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops SNJ54AC74W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

17.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.285 mm

Minimum fmax:

95 MHz

Trade Compliance

SNJ54AC74W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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