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SNJ54AC74J

Texas Instruments

SNJ54AC74J by Texas Instruments

SNJ54AC74J by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 17.5 ns propagation delay, and 3V nominal voltage. It operates at temperatures from -55 to 125°C, suitable for military applications requiring fast response times up to 70 MHz. The package style is in-line with dual terminals and MIL-PRF-38535 screening level for reliability.

Median Price

$10.446

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 54 parts In-Stock

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$9.693

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Rochester

USA . 25 parts In-Stock

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$11.200

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$10.020

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$9.430

25

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$9.430

Distributors (In-Stock)

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Digiode

USA . 1,639 parts In-Stock

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$8.940

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Vyrian

USA . 4,637 parts In-Stock

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QIE Inc.

USA . 35 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

USA . 20 parts In-Stock

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NAC Semi

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Distributors (Availability)

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Corphita

USA . 1,241 parts In-Stock

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$8.469

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$8.469

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AZTECH Wire

Italy . 583 parts In-Stock

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$13.830

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Parana Technologies

USA . 481 parts In-Stock

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$23.791

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$24.423

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$26.196

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$24.101

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IDEA Electronic Components Group

UK . 2,151 parts In-Stock

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$26.731

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$25.394

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$24.058

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ChromeModa Solutions

Germany . 174 parts In-Stock

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$26.731

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$21.919

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Microchip USA

USA . 2,228 parts In-Stock

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$27.550

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$27.160

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$26.960

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$26.760

2,228

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$27.160

$26.960

$26.760

QUARKTWIN TECHNOLOGY LTD

USA . 29,063 parts In-Stock

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Authorized Procurement Solutions

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Overview

Enhance your electronic projects with the SNJ54AC74J from Texas Instruments, a top-quality latches & flip-flops component perfect for military-grade applications. With a fast propagation delay and low power consumption, this dual-function device offers reliable performance in a compact package. Trust in Texas Instruments' reputation for excellence and unlock the potential of your designs with the SNJ54AC74J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package body material ensures durability and protection for the internal components, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 17.5 ns

The low propagation delay ensures fast response times, making this latch efficient for time-critical applications.

No. of Functions: 2

Having multiple functions allows for more versatile usage and flexibility in design.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this latch can withstand extreme conditions without degradation in performance.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and precise signal triggering, enhancing overall system performance.

Technology: CMOS

Built with CMOS technology, this latch offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops SNJ54AC74J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

17.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

95 MHz

Trade Compliance

SNJ54AC74J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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