Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments SNC54AS870FH is a MIL-STD-883 Class B (Modified) rated TTL memory IC in a ceramic chip carrier package. With 28 terminals and operating temperatures ranging from -55°C to 125°C, it's ideal for military-grade applications requiring high reliability and performance. This surface-mount IC features a square package shape with no lead terminals, making it suitable for rugged environments.
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Corphita
Ceramic material provides excellent thermal properties, making it suitable for high temperature environments.
Surface mount capability allows for easy and efficient installation on circuit boards, saving space and time during assembly.
This screening level ensures that the product meets specific quality standards, making it reliable and durable.
Square shape provides a compact design, ideal for applications where space is limited.
Having 28 terminals allows for more connections and functionality, making the IC versatile and capable of handling complex tasks.
Chip carrier style offers good protection for the IC and makes it easy to handle during installation and maintenance.
High maximum operating temperature ensures the IC can function reliably in various environments without risk of overheating.
Low minimum operating temperature guarantees the IC can perform in extreme cold conditions without malfunctioning.
Quad terminal position offers improved stability and connectivity for the IC, enhancing its operational performance.
Military grade temperature tolerance ensures the IC can withstand harsh conditions and operate consistently in demanding situations.
TTL technology provides fast switching and reliable performance, making the IC suitable for high-speed applications.
No lead terminal form reduces the risk of soldering defects and ensures better electrical conductivity for the IC.
Narrow terminal pitch allows for increased connectivity and density on the circuit board, enabling more efficient use of space.
Other Function Memory ICs SNC54AS870FH attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments
JESD-30 Code:
No. of Terminals:
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Minimum Operating Temperature:
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SNC54AS870FH Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
BAV99
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99-7-F
Multicomp Pro
Rfe International
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
LAN8720AI-CP-TR
Microchip Technology
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
261
Deltrol Controls
Other Relays;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
1N4148
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
TMS27C32NE4
Other Memory ICs;
TMS27C32-10NE4
DS1204V
Analog Devices
Analog Devices' DS1204V is a CMOS memory IC with 5V supply, 5 terminals, and 6mA max current. It operates from 0 to 70 °C, ideal for commercial applications requiring reliable non-volatile memory storage in microelectronic assemblies.
AT88SC25616C-SU
Atmel
CRYPTO MEMORY; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN; Qualification: Not Qualified;
DS6207-3
DS6207-3 by Analog Devices is a CMOS Memory Circuit with 384-bit memory density. It operates b/w 0 °C to 70°C, suitable for commercial applications. The IC has 5 terminals in a special shape package, ideal for various memory circuit functions.
SN74LS601ADW
SN74LS601ADW by Texas Instruments is a 64KX1 memory circuit IC with TTL technology. It operates asynchronously at 5V, with a memory density of 65536 bits. This small outline package is surface mountable and suitable for various commercial applications requiring reliable memory storage.
DS2502R+U
Other Memory ICs; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
MT38W2021A902ZQXZI.X69
Micron Technology
Micron Technology's MT38W2021A902ZQXZI.X69 is a 4MX16 memory IC with 67108864 bit memory density. Operating in synchronous mode, it has 88 terminals in a grid array package style. Ideal for industrial applications, it supports a memory width of 16 bits and operates b/w -40 to 85 °C temperature range.
CY8C20110-SX2IT
Infineon Technologies
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;
EPCQ32ASI8N
Intel
EPCQ32ASI8N by Intel is a 4MX8 NOR type memory IC with 3-STATE output, operating at up to 100 MHz clock frequency. It has a memory density of 33554432 bits and operates in industrial temperature grade applications. With a small outline package style and synchronous operation, it is suitable for various embedded systems requiring high-speed non-volatile memory solutions.
SNJ54ALS871JD
SNJ54ALS871JD by Texas Instruments is a MILITARY-grade TTL IC with 24 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This IC is commonly used in applications requiring high reliability and performance under extreme temperature conditions.
WSF512K32-27H2M
Microsemi
Microsemi's WSF512K32-27H2M is a 512Kx32 memory IC with CMOS technology. It operates asynchronously at 5V, with a temperature range of -55 to 125°C. Ideal for military applications due to its ceramic-metal package and gold terminal finish.
MR2A16AVMA35R
Everspin Technologies
MR2A16AVMA35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, suitable for industrial applications. This low-profile, fine-pitch grid array package has 48 terminals and offers a memory density of 4,194,304 bits.
SN74LS601ADWR
SN74LS601ADWR by Texas Instruments is a 64KX1 memory circuit IC with TTL technology. It operates asynchronously at a supply voltage range of 4.75V to 5.25V, suitable for commercial temperature grades. This small outline package with gull wing terminals is ideal for applications requiring 65536-bit memory density in various electronic devices.
TMS27PC32-15NE4
TACT2151-25JD
TACT2151-25JD by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It operates at a max temperature of 70°C and has an access time of 25ns. This CMOS technology IC is ideal for applications requiring high-speed memory functions in commercial-grade environments.
TMS4C1060-60N
TMS4C1060-60N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0 to 70°C and is ideal for commercial applications requiring fast memory processing in an IN-LINE package style.
DS28E80Q+U
MEMORY CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
M36W216T100ZA6T
STMicroelectronics
M36W216T100ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers reliable performance in compact designs.
SN74HC670JP4
SN74HC670JP4 by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it offers reliable performance in various electronic devices.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
SNC54170J
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
SNC54170W
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
SNC54AS870JT
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SNC54AS871FH
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Terminal Form: NO LEAD;
SNC54AS871JD
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SNC54LS170J
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
SNC54LS170W
Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
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