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SNC54AS870FH

Texas Instruments

SNC54AS870FH by Texas Instruments

The Texas Instruments SNC54AS870FH is a MIL-STD-883 Class B (Modified) rated TTL memory IC in a ceramic chip carrier package. With 28 terminals and operating temperatures ranging from -55°C to 125°C, it's ideal for military-grade applications requiring high reliability and performance. This surface-mount IC features a square package shape with no lead terminals, making it suitable for rugged environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,600

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-

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Digiode

USA . 1,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,735

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 49 parts In-Stock

1+ parts

$3.167

100+ parts

-

1k+ parts

$3.687

10k+ parts

-

49

$3.167

-

$3.687

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DigiPath Technology Company

USA . 1,038 parts In-Stock

1+ parts

$3.487

100+ parts

$3.208

1k+ parts

-

10k+ parts

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1,038

$3.487

$3.208

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$3.558

100+ parts

-

1k+ parts

$3.202

10k+ parts

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2,322

$3.558

-

$3.202

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ChromeModa Solutions

Germany . 2,112 parts In-Stock

1+ parts

$3.558

100+ parts

$2.918

1k+ parts

-

10k+ parts

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2,112

$3.558

$2.918

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One Stop Electronics

USA . 1,049 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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10k+ parts

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1,049

$7.000

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AZTECH Wire

Italy . 695 parts In-Stock

1+ parts

$10.112

100+ parts

-

1k+ parts

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10k+ parts

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695

$10.112

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Corphita

USA . 3,517 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,517

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SNC54AS870FH. Crafted with precision and expertise, this memory IC offers unparalleled performance and reliability in a wide range of applications. Whether you're designing aerospace systems or industrial machinery, this product delivers superior quality and value. Trust in Texas Instruments to provide top-of-the-line solutions that meet your needs and exceed your expectations. Elevate your projects with the SNC54AS870FH and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making it suitable for high temperature environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and time during assembly.

Screening Level: MIL-STD-883 Class B (Modified)

This screening level ensures that the product meets specific quality standards, making it reliable and durable.

Package Shape: SQUARE

Square shape provides a compact design, ideal for applications where space is limited.

No. of Terminals: 28

Having 28 terminals allows for more connections and functionality, making the IC versatile and capable of handling complex tasks.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers good protection for the IC and makes it easy to handle during installation and maintenance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the IC can function reliably in various environments without risk of overheating.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature guarantees the IC can perform in extreme cold conditions without malfunctioning.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity for the IC, enhancing its operational performance.

Temperature Grade: MILITARY

Military grade temperature tolerance ensures the IC can withstand harsh conditions and operate consistently in demanding situations.

Technology: TTL

TTL technology provides fast switching and reliable performance, making the IC suitable for high-speed applications.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of soldering defects and ensures better electrical conductivity for the IC.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for increased connectivity and density on the circuit board, enabling more efficient use of space.

Technical Specifications

Other Function Memory ICs SNC54AS870FH attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54AS870FH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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