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SN761663DGKG4

Texas Instruments

SN761663DGKG4 by Texas Instruments

SN761663DGKG4 by Texas Instruments is a small outline, thin profile IC with 8 terminals. It operates b/w -20°C to 85°C and requires a supply voltage of 4.5V to 5.5V. Ideal for consumer circuits, this square-shaped IC is surface mountable and has a dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,714 parts In-Stock

1+ parts

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6,714

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Digiode

USA . 3,124 parts In-Stock

1+ parts

-

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3,124

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

$2.166

100+ parts

-

1k+ parts

$2.679

10k+ parts

-

2,225

$2.166

-

$2.679

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DigiPath Technology Company

USA . 471 parts In-Stock

1+ parts

$2.385

100+ parts

$2.194

1k+ parts

-

10k+ parts

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471

$2.385

$2.194

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ChromeModa Solutions

Germany . 2,942 parts In-Stock

1+ parts

$2.434

100+ parts

$1.996

1k+ parts

-

10k+ parts

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2,942

$2.434

$1.996

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IDEA Electronic Components Group

UK . 2,141 parts In-Stock

1+ parts

$2.434

100+ parts

-

1k+ parts

$2.191

10k+ parts

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2,141

$2.434

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$2.191

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$8.522

100+ parts

-

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685

$8.522

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One Stop Electronics

USA . 820 parts In-Stock

1+ parts

$13.800

100+ parts

-

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820

$13.800

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Microchip USA

USA . 5,821 parts In-Stock

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5,821

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Corphita

USA . 4,628 parts In-Stock

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4,628

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Overview

Upgrade your consumer electronics with the SN761663DGKG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. Designed for a wide range of applications in the consumer electronics industry, this small outline, thin profile IC offers superior performance and durability. With a minimum supply voltage of 4.5V and a maximum supply voltage of 5.5V, this IC provides optimal functionality while ensuring energy efficiency. Trust Texas Instruments to deliver cutting-edge technology that enhances the capabilities of your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, ideal for compact consumer electronics.

No. of Terminals: 8

Having 8 terminals offers versatility in connectivity options, allowing for a range of applications and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and operate reliably in various settings.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures the IC can function in cold environments without any issues, expanding its usability.

Terminal Position: DUAL

Dual terminal position provides redundant connections, enhancing the reliability and stability of the IC in critical applications.

Width: 3 mm

Narrow width allows for space-saving installation on the PCB, especially in small electronic devices where size is a concern.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage enables energy-efficient operation, reducing power consumption and extending battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections, ensuring stable electrical performance and ease of assembly.

Technical Specifications

Other Function Consumer ICs SN761663DGKG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SN761663DGKG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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