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SN761678DCH

Texas Instruments

SN761678DCH by Texas Instruments

Texas Instruments' SN761678DCH is a 30-terminal IC with 5V power supply, operating b/w -20°C to 85°C. It's a surface-mount device made of plastic/epoxy, ideal for various consumer electronics applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,194 parts In-Stock

1+ parts

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3,194

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Digiode

USA . 692 parts In-Stock

1+ parts

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692

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,819 parts In-Stock

1+ parts

$3.297

100+ parts

-

1k+ parts

$3.821

10k+ parts

-

1,819

$3.297

-

$3.821

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ChromeModa Solutions

Germany . 2,855 parts In-Stock

1+ parts

$3.705

100+ parts

$3.038

1k+ parts

-

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2,855

$3.705

$3.038

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IDEA Electronic Components Group

UK . 1,998 parts In-Stock

1+ parts

$3.705

100+ parts

-

1k+ parts

$3.334

10k+ parts

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1,998

$3.705

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$3.334

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AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$6.449

100+ parts

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447

$6.449

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One Stop Electronics

USA . 313 parts In-Stock

1+ parts

$15.800

100+ parts

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313

$15.800

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A-Z Elektronik GmbH

Germany . 7,107 parts In-Stock

1+ parts

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7,107

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Corphita

USA . 3,338 parts In-Stock

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3,338

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DigiPath Technology Company

USA . 2,335 parts In-Stock

1+ parts

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100+ parts

$3.340

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2,335

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$3.340

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Kepictronics

USA . 1,700 parts In-Stock

1+ parts

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1,700

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Microchip USA

USA . 108 parts In-Stock

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108

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Overview

Discover the superior quality and reliability of the SN761678DCH by Texas Instruments, a leading manufacturer in the industry. This versatile consumer IC is perfect for a wide range of applications, offering unmatched performance and efficiency. With a durable plastic/epoxy package body and surface mount option, this product is designed to meet your needs. Experience the value and benefits of the SN761678DCH, providing customers with exceptional results and peace of mind. Choose Texas Instruments for cutting-edge technology and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a cost-effective and durable material, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards, saving space and reducing overall production costs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and devices, ensuring versatility.

No. of Terminals: 30

The high number of terminals allows for more connectivity options and functions, making the product suitable for complex circuits and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures without compromising performance, ensuring reliability in various environments.

Minimum Operating Temperature: -20 °C

The wide range of operating temperatures, from -20 to 85°C, makes the product suitable for use in both extreme cold and hot conditions, increasing its versatility.

Technical Specifications

Other Function Consumer ICs SN761678DCH attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP30,.25,20

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Trade Compliance

SN761678DCH General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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