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SN76710N

Texas Instruments

SN76710N by Texas Instruments

SN76710N by Texas Instruments is a consumer circuit IC with 16 terminals in an in-line package. Operating temperature range from 0°C to 70°C, suitable for commercial applications. Utilizes bipolar technology and features a rectangular plastic/epoxy package body.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,777 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,777

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-

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Digiode

USA . 2,389 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,389

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

$1.070

100+ parts

-

1k+ parts

$1.922

10k+ parts

-

1,302

$1.070

-

$1.922

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DigiPath Technology Company

USA . 1,478 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

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1,478

$1.178

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ChromeModa Solutions

Germany . 3,504 parts In-Stock

1+ parts

$1.202

100+ parts

$0.986

1k+ parts

-

10k+ parts

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3,504

$1.202

$0.986

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$1.202

100+ parts

-

1k+ parts

$1.082

10k+ parts

-

789

$1.202

-

$1.082

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One Stop Electronics

USA . 853 parts In-Stock

1+ parts

$10.800

100+ parts

-

1k+ parts

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10k+ parts

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853

$10.800

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$11.068

100+ parts

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612

$11.068

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Corphita

USA . 1,547 parts In-Stock

1+ parts

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1,547

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Overview

With the SN76710N by Texas Instruments, you can trust in the high-quality manufacturing and innovative technology that this leading brand is known for. This versatile consumer IC offers a wide range of applications in various industries, providing customers with reliable performance and flexibility. Experience the value and benefits of this product, from its durable plastic/epoxy package body to its efficient operation in commercial-grade temperatures. Trust in Texas Instruments to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within circuit boards or electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, making it suitable for various household electronic devices.

No. of Terminals: 16

Sufficient number of terminals for connecting to external components or devices, allowing for versatile use.

Package Style (Meter): IN-LINE

In-line package style is convenient for mounting in a linear arrangement, saving space on the circuit board.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the IC to external devices, enhancing compatibility.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions typically found in commercial settings.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, making it suitable for consumer electronic applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy soldering onto the circuit board, ensuring secure connections and reliable operation.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch allows for easy and precise placement on the circuit board, simplifying the assembly process.

Technical Specifications

Other Function Consumer ICs SN76710N attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76710N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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