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SN74LVTH573PWG4

Texas Instruments

SN74LVTH573PWG4 by Texas Instruments

SN74LVTH573PWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 3.3V, suitable for industrial applications. It features a 64 Amp max I (ol), operates b/w -40 to 85 °C, and has a terminal pitch of 0.65 mm for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 93,930 parts In-Stock

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Vyrian

USA . 8,314 parts In-Stock

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Digiode

USA . 2,341 parts In-Stock

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2,341

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Distributors (Availability)

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Andel Nordic

Denmark . 1,775 parts In-Stock

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$5.235

100+ parts

-

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$5.026

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$5.026

1,775

$5.235

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$5.026

$5.026

One Stop Electronics

USA . 299 parts In-Stock

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$12.000

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299

$12.000

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Parana Technologies

USA . 1,865 parts In-Stock

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$16.456

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$16.748

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$16.456

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$16.748

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AZTECH Wire

Italy . 817 parts In-Stock

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$17.910

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817

$17.910

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ChromeModa Solutions

Germany . 4,171 parts In-Stock

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$18.490

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$15.162

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$18.490

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IDEA Electronic Components Group

UK . 1,646 parts In-Stock

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$18.490

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$17.566

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$16.641

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1,646

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Microchip USA

USA . 2,143 parts In-Stock

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DigiPath Technology Company

USA . 2,050 parts In-Stock

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$16.671

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$16.671

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Corphita

USA . 1,604 parts In-Stock

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Perfect Parts

USA . 1,019 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVTH573PWG4 by Texas Instruments, a high-quality 8-bit bus driver & transceiver designed to provide seamless data transmission. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product guarantees reliability and performance. Ideal for various applications, this component offers customers value through its fast propagation delay, low power consumption, and 3-state output characteristics. Upgrade your designs with the SN74LVTH573PWG4 and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and insulation, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures fast signal transmission, making the product efficient for bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it easy to integrate into various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial environments where temperatures can fluctuate.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for improved performance, high speed, and low power consumption, making it an efficient choice for bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74LVTH573PWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LVTH573PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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