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SN74LVT240ADGVRG4

Texas Instruments

SN74LVT240ADGVRG4 by Texas Instruments

SN74LVT240ADGVRG4 by Texas Instruments is a 20-terminal bus driver with 3.3V nominal voltage, featuring 4ns propagation delay and 64 Amp max I (ol). It is ideal for industrial applications requiring fast signal transmission in a compact package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,157 parts In-Stock

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3,157

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Digiode

USA . 2,644 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,459 parts In-Stock

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$6.057

100+ parts

-

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$5.815

10k+ parts

$5.815

2,459

$6.057

-

$5.815

$5.815

AZTECH Wire

Italy . 531 parts In-Stock

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$9.346

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531

$9.346

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One Stop Electronics

USA . 1,084 parts In-Stock

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$13.000

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1,084

$13.000

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Parana Technologies

USA . 854 parts In-Stock

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$25.940

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$26.535

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854

$25.940

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$26.535

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DigiPath Technology Company

USA . 2,041 parts In-Stock

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$28.563

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$26.278

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2,041

$28.563

$26.278

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ChromeModa Solutions

Germany . 5,201 parts In-Stock

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$29.146

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$23.900

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$29.146

$23.900

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IDEA Electronic Components Group

UK . 250 parts In-Stock

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$29.146

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$27.689

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$26.231

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250

$29.146

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$26.231

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Microchip USA

USA . 474 parts In-Stock

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474

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Corphita

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Overview

Enhance your electronic designs with the SN74LVT240ADGVRG4 by Texas Instruments. Renowned for their quality and reliability, Texas Instruments offers a wide range of innovative products in the Bus Driver & Transceivers category. This versatile product provides customers with fast propagation delay, efficient power supplies, and a compact package style. Ideal for industrial applications, this 3-STATE output device ensures seamless data transmission while optimizing performance. Elevate your projects with the trusted technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, ideal for use in a variety of environments.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improves overall performance.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in controlling the output signal.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVT240ADGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVT

JESD-30 Code:

R-PDSO-G20

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVT240ADGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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