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SN74LVCH16373AGRDR

Texas Instruments

SN74LVCH16373AGRDR by Texas Instruments

SN74LVCH16373AGRDR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.2 ns and output current of 24 Amp. It operates at a supply voltage range of 1.65V to 3.6V, making it suitable for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,613 parts In-Stock

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6,613

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Digiode

USA . 4,284 parts In-Stock

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4,284

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Distributors (Availability)

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Parana Technologies

USA . 1,725 parts In-Stock

1+ parts

$12.116

100+ parts

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$12.524

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1,725

$12.116

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$12.524

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DigiPath Technology Company

USA . 1,319 parts In-Stock

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$13.341

100+ parts

$12.273

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1,319

$13.341

$12.273

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ChromeModa Solutions

Germany . 6,737 parts In-Stock

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$13.613

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$11.163

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$13.613

$11.163

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IDEA Electronic Components Group

UK . 1,410 parts In-Stock

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$13.613

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$12.932

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$12.252

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1,410

$13.613

$12.932

$12.252

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AZTECH Wire

Italy . 265 parts In-Stock

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$13.756

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$13.756

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One Stop Electronics

USA . 657 parts In-Stock

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$34.000

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657

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Andel Nordic

Denmark . 2,742 parts In-Stock

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$60.627

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$58.202

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$58.202

2,742

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$58.202

QUARKTWIN TECHNOLOGY LTD

USA . 25,211 parts In-Stock

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Microchip USA

USA . 5,202 parts In-Stock

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Corphita

USA . 2,897 parts In-Stock

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Overview

Unlock seamless data transmission and superior performance with the SN74LVCH16373AGRDR by Texas Instruments. With a trusted manufacturer like Texas Instruments, you can count on top-notch quality and reliability. Designed for Bus Driver & Transceiver applications, this product offers unparalleled value and benefits to customers. Say goodbye to delays and errors with the fast propagation delay and 3-STATE output characteristics. Trust in Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-lasting usage in various environments.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making it convenient for integration into compact designs.

No. of Functions: 2

Having multiple functions in one device increases the versatility and functionality of the product, providing more value for users.

Package Shape: RECTANGULAR

Rectangular package shape offers easy handling and placement during assembly, ensuring compatibility with standard PCB layouts.

No. of Bits: 8

With 8 bits, this bus driver/transceiver can handle a wide range of data transmission requirements, making it suitable for diverse applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps to minimize power consumption and heat generation, making this product energy-efficient.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures proper signal integrity and stability in high-speed data transmission, enhancing the overall performance of the product.

Power Supplies (V): 3.3

Supporting multiple power supply voltages (3.3V) allows for compatibility with various systems and devices, increasing the product's flexibility.

No. of Terminals: 54

With 54 terminals, this product offers ample connectivity options for interfacing with other components, enabling complex system integration.

Maximum I (ol): 24 Amp

High output current capability of 24A ensures robust driving capabilities for connected devices, making this product suitable for demanding applications.

Propagation Delay (tpd): 5.3 ns

Although slightly higher than the nominal value, the propagation delay of 5.3ns is still fast enough for efficient data transmission, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C allows for reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output capability provides flexibility in controlling the output signal states, allowing for efficient bus sharing and system design.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments, ensuring reliable operation in various conditions.

Terminal Position: BOTTOM

Bottom terminal position offers convenient access for soldering and connection, simplifying the assembly process and ensuring secure electrical connections.

No. of Ports: 2

Having 2 ports enables simultaneous communication with multiple devices, increasing the product's versatility and compatibility with various system configurations.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm minimizes the overall profile of the product, allowing for compact design integration and efficient use of space on the PCB.

Width: 5.5 mm

Compact width of 5.5mm enables easy integration into tight PCB layouts, ensuring compatibility with space-constrained designs.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, preventing signal distortion and ensuring reliable data transmission in the system.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage of 1.65V allows for operation in low-power scenarios, making this product suitable for battery-operated devices and energy-efficient systems.

Length: 8 mm

Compact length of 8mm contributes to the overall small form factor of the product, enabling easy integration into space-limited designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance consistency in demanding operating conditions, making this product suitable for rugged industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall efficiency and reliability of the product.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and facilitates easy soldering during assembly, ensuring secure and durable terminal connections.

Packing Method: TR

TR (tape and reel) packing method offers convenient handling, storage, and pick-and-place assembly during manufacturing, streamlining the production process.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB, maximizing space efficiency and enabling compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

Wide maximum supply voltage range of up to 3.6V ensures compatibility with various power sources and systems, enhancing the product's versatility and applicability.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16373AGRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.5 mm

Trade Compliance

SN74LVCH16373AGRDR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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