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SN74LVC74APWTG4

Texas Instruments

SN74LVC74APWTG4 by Texas Instruments

SN74LVC74APWTG4 by Texas Instruments is a dual-function latch with 5.2ns propagation delay, ideal for automotive applications. Operating at 1.8V to 3.6V, it offers a max frequency of 150MHz and low power consumption of 0.01mA ICC. This CMOS technology flip-flop has a compact design with small outline and thin profile package style for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,879 parts In-Stock

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3,879

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Digiode

USA . 1,595 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,171 parts In-Stock

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$5.000

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$5.000

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Component Stockers USA

USA . 5,260 parts In-Stock

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$6.090

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$6.090

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Parana Technologies

USA . 1,387 parts In-Stock

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$9.958

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$10.524

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1,387

$9.958

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$10.524

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DigiPath Technology Company

USA . 1,790 parts In-Stock

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$10.965

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1,790

$10.965

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ChromeModa Solutions

Germany . 3,009 parts In-Stock

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$11.189

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$9.175

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3,009

$11.189

$9.175

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$11.189

100+ parts

$10.630

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$10.070

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2,172

$11.189

$10.630

$10.070

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AZTECH Wire

Italy . 433 parts In-Stock

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$15.667

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$15.667

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One Stop Electronics

USA . 367 parts In-Stock

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$19.000

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Argo Parts USA

USA . 4,051 parts In-Stock

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Corphita

USA . 2,555 parts In-Stock

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Microchip USA

USA . 2,272 parts In-Stock

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Perfect Parts

USA . 1,213 parts In-Stock

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Continental Prestige Electronics

USA . 522 parts In-Stock

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522

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unlock the power of precision and reliability with the SN74LVC74APWTG4 by Texas Instruments. As a leading manufacturer, Texas Instruments delivers top-notch quality with its latches & flip-flops, offering seamless integration in a variety of applications. With a nominal supply voltage of 1.8V and maximum operating temperature of 125°C, this product provides exceptional performance and durability. Experience the advantage of fast propagation delay, low power consumption, and compact design, making it the perfect choice for automotive-grade solutions. Upgrade your projects with the SN74LVC74APWTG4 and elevate your efficiency to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop more lightweight and cost-effective.

Propagation Delay At Nominal Supply: 5.2 ns

With a fast propagation delay of 5.2 ns, this latch & flip-flop ensures efficient operation and response time.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V helps in reducing power consumption.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch & flip-flop can withstand tough environmental conditions.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity in the latch & flip-flop.

Minimum fmax: 150 MHz

With a minimum frequency of 150 MHz, this latch & flip-flop can handle high-speed data processing efficiently.

Technical Specifications

Latches & Flip-Flops SN74LVC74APWTG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

150 MHz

Trade Compliance

SN74LVC74APWTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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