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SN74LVC573AZQNR

Texas Instruments

SN74LVC573AZQNR by Texas Instruments

SN74LVC573AZQNR by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 3.3V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and a package style of GRID ARRAY for surface mount assembly.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,700 parts In-Stock

1+ parts

$0.290

100+ parts

$0.280

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$0.280

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2,700

$0.290

$0.280

$0.280

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Distributors (In-Stock)

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Chip Stock

USA . 8,310 parts In-Stock

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8,310

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Vyrian

USA . 6,206 parts In-Stock

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6,206

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Velocity Electronics

USA . 5,988 parts In-Stock

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Digiode

USA . 4,097 parts In-Stock

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4,097

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Distributors (Availability)

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AZTECH Wire

Italy . 394 parts In-Stock

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$5.835

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394

$5.835

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Parana Technologies

USA . 2,279 parts In-Stock

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$20.171

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$20.121

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2,279

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$20.121

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One Stop Electronics

USA . 505 parts In-Stock

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$22.000

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505

$22.000

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DigiPath Technology Company

USA . 1,973 parts In-Stock

1+ parts

$22.211

100+ parts

$20.434

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1,973

$22.211

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ChromeModa Solutions

Germany . 5,746 parts In-Stock

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$22.664

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$18.584

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5,746

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IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$22.664

100+ parts

$21.531

1k+ parts

$20.398

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1,760

$22.664

$21.531

$20.398

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Perfect Parts

USA . 5,542 parts In-Stock

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5,542

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Corphita

USA . 1,377 parts In-Stock

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Microchip USA

USA . 306 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC573AZQNR by Texas Instruments, a top-quality bus driver and transceiver perfect for a wide range of applications. With a reliable manufacturer like Texas Instruments behind it, this product offers unmatched value and performance. Delivering fast propagation delay and 3-state output characteristics, this component ensures seamless data transmission while operating at industrial temperatures. Trust in Texas Instruments to provide innovative solutions for your projects, choose the SN74LVC573AZQNR for superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 6.9 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Bits: 8

8 bits provide sufficient data transmission capacity for various communication protocols and applications.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures reliable operation of the bus driver & transceivers.

Output Characteristics: 3-STATE

3-STATE output allows for flexible control over the output signal, enhancing versatility and compatibility with different devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range of -40°C to 85°C enables reliable operation in both hot and cold conditions.

Technical Specifications

Bus Driver & Transceivers SN74LVC573AZQNR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

22.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

SN74LVC573AZQNR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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