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SN74LVC543APWRE4

Texas Instruments

SN74LVC543APWRE4 by Texas Instruments

SN74LVC543APWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity is TRUE, and has independent control with a terminal pitch of 0.65 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,028 parts In-Stock

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Digiode

USA . 4,071 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 444 parts In-Stock

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$9.279

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Parana Technologies

USA . 1,449 parts In-Stock

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$17.966

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$18.130

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DigiPath Technology Company

USA . 563 parts In-Stock

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$19.783

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563

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ChromeModa Solutions

Germany . 1,926 parts In-Stock

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$20.187

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$16.553

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

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$20.187

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$19.178

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$18.168

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One Stop Electronics

USA . 765 parts In-Stock

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$35.000

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Corphita

USA . 2,963 parts In-Stock

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Microchip USA

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Overview

Unlock seamless data transmission with the SN74LVC543APWRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures fast propagation delay and efficient output characteristics. With a compact design and advanced technology, customers can enjoy the benefits of true value and enhanced connectivity. Trust Texas Instruments to deliver top-notch quality and innovation in every component, making the SN74LVC543APWRE4 a must-have for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the bus driver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7 ns

The low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the bus driver onto a circuit board, saving time and effort during assembly.

No. of Bits: 8

With 8 bits, this bus driver can handle a wide range of data processing tasks, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V, this bus driver offers energy efficiency and can be used in battery-powered devices.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this bus driver has a wide voltage range, allowing for compatibility with different power sources.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature requirements, this bus driver can withstand harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC543APWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LVC543APWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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