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SN74LVC2952APW

Texas Instruments

SN74LVC2952APW by Texas Instruments

SN74LVC2952APW by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.2 ns, operating at a supply voltage of 1.8V to 3.3V. It features a small outline package and is ideal for industrial applications requiring bidirectional control with positive edge triggering.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,860 parts In-Stock

1+ parts

-

100+ parts

$0.622

1k+ parts

$0.517

10k+ parts

$0.461

7,860

-

$0.622

$0.517

$0.461

Verical

USA . 4,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.646

10k+ parts

$0.576

4,020

-

-

$0.646

$0.576

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,096 parts In-Stock

1+ parts

$0.484

100+ parts

-

1k+ parts

-

10k+ parts

-

4,096

$0.484

-

-

-

Vyrian

USA . 8,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,761

-

-

-

-

DigiKey Marketplace

USA . 7,860 parts In-Stock

1+ parts

-

100+ parts

$0.530

1k+ parts

-

10k+ parts

-

7,860

-

$0.530

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,626 parts In-Stock

1+ parts

$0.458

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

$0.458

-

-

-

Parana Technologies

USA . 2,001 parts In-Stock

1+ parts

$7.763

100+ parts

-

1k+ parts

$8.303

10k+ parts

-

2,001

$7.763

-

$8.303

-

DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$8.548

100+ parts

$7.864

1k+ parts

-

10k+ parts

-

1,334

$8.548

$7.864

-

-

ChromeModa Solutions

Germany . 1,396 parts In-Stock

1+ parts

$8.722

100+ parts

$7.152

1k+ parts

-

10k+ parts

-

1,396

$8.722

$7.152

-

-

IDEA Electronic Components Group

UK . 1,284 parts In-Stock

1+ parts

$8.722

100+ parts

$8.286

1k+ parts

$7.850

10k+ parts

-

1,284

$8.722

$8.286

$7.850

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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28,049

-

-

-

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Microchip USA

USA . 322 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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322

-

-

-

-

Overview

Unlock the power of seamless data transmission with Texas Instruments' SN74LVC2952APW Bus Driver & Transceivers. Designed for industrial-grade performance, this compact and reliable product offers a fast propagation delay of 8.2 ns, ensuring efficient communication across various applications. With a wide voltage range and 3-state output characteristics, customers can trust in the quality and versatility of this device. Say goodbye to connectivity issues and hello to enhanced productivity with the SN74LVC2952APW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Propagation Delay At Nominal Supply: 8.2 ns

The low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V helps in reducing power consumption and heat generation, improving overall energy efficiency.

No. of Bits: 8

The 8-bit configuration provides sufficient data handling capacity for various communication protocols and applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in harsh environmental conditions, ensuring long-term performance and durability.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC2952APW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LVC2952APW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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