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SN74LVC2244ADBRG4

Texas Instruments

SN74LVC2244ADBRG4 by Texas Instruments

SN74LVC2244ADBRG4 by Texas Instruments is a 2-bit bus driver with 5.5 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 1.8V to 3.6V and has a max operating temperature of 85°C. This CMOS technology device features a small outline package with dual terminals and true output polarity, making it ideal for compact electronic designs requiring fast signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,936 parts In-Stock

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Digiode

USA . 1,848 parts In-Stock

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USA . 114 parts In-Stock

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Prism Electronics

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Component Stockers USA

USA . 31,811 parts In-Stock

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$2.550

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Andel Nordic

Denmark . 2,374 parts In-Stock

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$2.711

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$2.603

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AZTECH Wire

Italy . 281 parts In-Stock

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$7.231

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One Stop Electronics

USA . 528 parts In-Stock

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Parana Technologies

USA . 1,149 parts In-Stock

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$16.954

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$17.183

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DigiPath Technology Company

USA . 1,020 parts In-Stock

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$18.668

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$17.175

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ChromeModa Solutions

Germany . 5,301 parts In-Stock

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,528 parts In-Stock

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Microchip USA

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Perfect Parts

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Corphita

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Overview

Enhance your electronic projects with the SN74LVC2244ADBRG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a leading product in the Bus Driver & Transceivers category, this small-outline, shrink-pitch package offers 2 functions, 4 bits, and a true output polarity. With a fast propagation delay of 5.5 ns and a maximum operating temperature of 85°C, this industrial-grade technology is ideal for a wide range of applications. Trust in Texas Instruments to deliver exceptional performance and value, ensuring your projects run smoothly and efficiently every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, making it suitable for use in various environments.

Propagation Delay At Nominal Supply: 5.5 ns

The low propagation delay ensures fast data transmission, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, saving time and effort during assembly.

No. of Functions: 2

Having two functions in one component adds versatility and functionality to the product, making it a cost-effective solution.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage allows for efficient power consumption, making it suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in optimizing signal integrity and performance, ensuring reliable data transmission.

Power Supplies (V): 3.3

The compatibility with a standard power supply voltage of 3.3V makes it easy to integrate into existing systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connection points, enabling complex interconnections and functionalities.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor provides added protection and flexibility in driving external circuitry, enhancing overall system reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is suitable for harsh environments and rugged applications, ensuring reliable operation in challenging conditions.

Technical Specifications

Bus Driver & Transceivers SN74LVC2244ADBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LVC2244ADBRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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