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SN74LVC16244ADLRG4

Texas Instruments

SN74LVC16244ADLRG4 by Texas Instruments

SN74LVC16244ADLRG4 by Texas Instruments is a 4-bit bus driver with 3-STATE output, operating at a supply voltage of 1.8V to 3.6V. It features a propagation delay of 4.1ns, making it ideal for high-speed applications in automotive technology due to its small outline package and low power consumption of 0.02mA.

Median Price

$0.723

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

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$0.723

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$0.723

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Vyrian

USA . 3,864 parts In-Stock

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Digiode

USA . 268 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 84 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 4,037 parts In-Stock

1+ parts

$0.723

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$0.723

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Continental Prestige Electronics

USA . 1,981 parts In-Stock

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$0.723

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$0.709

1,981

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$0.709

Netroflash

USA . 50 parts In-Stock

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$0.723

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$0.687

10k+ parts

$0.672

50

$0.723

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$0.687

$0.672

Andel Nordic

Denmark . 3,087 parts In-Stock

1+ parts

$9.237

100+ parts

-

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$8.867

10k+ parts

$8.867

3,087

$9.237

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$8.867

$8.867

AZTECH Wire

Italy . 892 parts In-Stock

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$11.424

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$11.696

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$11.579

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$11.111

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$11.696

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Parana Technologies

USA . 1,631 parts In-Stock

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$25.818

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$26.422

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DigiPath Technology Company

USA . 1,636 parts In-Stock

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$28.429

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ChromeModa Solutions

Germany . 5,156 parts In-Stock

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$29.009

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$23.787

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$29.009

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

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$29.009

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$27.559

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$26.108

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2,334

$29.009

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$26.108

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Ampacity Inc.

Singapore . 1,353 parts In-Stock

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$57.000

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One Stop Electronics

USA . 604 parts In-Stock

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$63.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,519 parts In-Stock

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Microchip USA

USA . 1,525 parts In-Stock

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Corphita

USA . 300 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC16244ADLRG4 from Texas Instruments, a top-tier manufacturer known for premium quality and reliability. This bus driver and transceiver offers seamless integration and high-speed performance in a compact package, making it ideal for a wide range of applications. Experience the value of quick propagation delay, versatile 3-state output, and low power consumption. Elevate your projects with this innovative solution that brings efficiency and precision to every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay ensures fast and efficient operation of the bus driver & transceivers.

No. of Functions: 4

With 4 functions, this product can handle multiple tasks efficiently.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy efficient.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state when not in use, reducing power consumption.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes it suitable for various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers SN74LVC16244ADLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74LVC16244ADLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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