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SN74LVC162244ADLG4

Texas Instruments

SN74LVC162244ADLG4 by Texas Instruments

SN74LVC162244ADLG4 by Texas Instruments is a 4-bit bus driver with 3.3V power supply, 6ns propagation delay, and 50pF load capacitance. It is used in automotive applications for unidirectional data transmission with a max operating temperature of 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,152 parts In-Stock

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Vyrian

USA . 1,915 parts In-Stock

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Electronics Depot

USA . 5 parts In-Stock

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Andel Nordic

Denmark . 2,378 parts In-Stock

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$5.330

100+ parts

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$5.117

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$5.117

2,378

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$5.117

AZTECH Wire

Italy . 740 parts In-Stock

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$9.722

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Parana Technologies

USA . 321 parts In-Stock

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$26.593

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$27.160

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

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$29.880

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$28.386

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$26.892

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$26.892

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ChromeModa Solutions

Germany . 941 parts In-Stock

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$29.880

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$24.502

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One Stop Electronics

USA . 291 parts In-Stock

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$33.000

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Component Stockers USA

USA . 795 parts In-Stock

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$99.990

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$99.990

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DigiPath Technology Company

USA . 1,481 parts In-Stock

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$26.940

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Microchip USA

USA . 1,393 parts In-Stock

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Corphita

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Overview

Discover the unparalleled quality and reliability of the SN74LVC162244ADLG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional bus driver & transceivers for a wide range of applications. With a focus on innovation and performance, this product offers customers unmatched value, benefits, and advantages. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 4.4 ns

With a fast propagation delay, this product ensures quick data transmission, enhancing efficiency in bus driver and transceiver applications.

Surface Mount: YES

The surface mount feature allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the overall design and reducing costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in minimizing power consumption and improving energy efficiency.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures good conductivity and reliability, leading to stable performance over time.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product can withstand harsh temperature conditions, making it suitable for in-vehicle electronics.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC162244ADLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74LVC162244ADLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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