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SN74LV273APWE4

Texas Instruments

SN74LV273APWE4 by Texas Instruments

SN74LV273APWE4 by Texas Instruments is an 8-bit latch with a propagation delay of 21 ns at 3.3V, suitable for automotive applications. It operates on a supply voltage range of 2-5.5V, has a max frequency of 45 MHz, and features positive edge triggering for efficient performance in various electronic systems.

Median Price

$0.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 980 parts In-Stock

1+ parts

$0.900

100+ parts

$0.624

1k+ parts

$0.516

10k+ parts

$0.361

980

$0.900

$0.624

$0.516

$0.361

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,850 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

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-

2,850

$0.855

-

-

-

Chip Stock

USA . 52,180 parts In-Stock

1+ parts

-

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52,180

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Vyrian

USA . 6,110 parts In-Stock

1+ parts

-

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6,110

-

-

-

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Nova Conductors

Japan . 31 parts In-Stock

1+ parts

-

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-

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 445 parts In-Stock

1+ parts

$0.541

100+ parts

-

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-

10k+ parts

-

445

$0.541

-

-

-

Semicontronic

India . 780 parts In-Stock

1+ parts

$0.770

100+ parts

$0.751

1k+ parts

$0.747

10k+ parts

-

780

$0.770

$0.751

$0.747

-

Ampacity Inc.

Singapore . 481 parts In-Stock

1+ parts

$0.770

100+ parts

-

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481

$0.770

-

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Corphita

USA . 4,852 parts In-Stock

1+ parts

$0.810

100+ parts

-

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4,852

$0.810

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Parana Technologies

USA . 1,773 parts In-Stock

1+ parts

$18.833

100+ parts

-

1k+ parts

$18.911

10k+ parts

-

1,773

$18.833

-

$18.911

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$19.114

100+ parts

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612

$19.114

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ChromeModa Solutions

Germany . 4,110 parts In-Stock

1+ parts

$21.161

100+ parts

$17.352

1k+ parts

-

10k+ parts

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4,110

$21.161

$17.352

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IDEA Electronic Components Group

UK . 52 parts In-Stock

1+ parts

$21.161

100+ parts

$20.103

1k+ parts

$19.045

10k+ parts

-

52

$21.161

$20.103

$19.045

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Microchip USA

USA . 2,488 parts In-Stock

1+ parts

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2,488

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 1,767 parts In-Stock

1+ parts

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100+ parts

$19.079

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1,767

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$19.079

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Continental Prestige Electronics

USA . 1,394 parts In-Stock

1+ parts

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1,394

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Argo Parts USA

USA . 1,211 parts In-Stock

1+ parts

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1,211

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Overview

Upgrade your electronics with the high-quality SN74LV273APWE4 latches & flip-flops by Texas Instruments. Designed for automotive applications, this product offers a fast propagation delay of 21ns and a maximum frequency of 45MHz at nominal supply voltage of 3.3V. With a compact package style and dual terminal position, this versatile component ensures reliable performance. Trust Texas Instruments for cutting-edge technology and superior products that deliver exceptional value to customers seeking efficiency and precision in their projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This lightweight and durable material makes the product suitable for a variety of applications.

Propagation Delay:

21 ns - With a fast propagation delay, this latch and flip-flop ensures efficient signal processing.

Surface Mount:

YES - The surface mount option simplifies the installation process and saves space on the PCB.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration into existing circuit designs.

No. of Bits:

8 - This product is ideal for applications requiring the processing of multiple bits of data simultaneously.

Nominal Supply Voltage / Vsup (V):

3.3 - Compatible with a common supply voltage, making it versatile for different projects.

Load Capacitance (CL):

50 pF - Can handle a moderate load capacitance, suitable for a wide range of applications.

Power Supplies (V):

3.3 - Operates efficiently with a 3.3V power supply, optimizing power consumption.

No. of Terminals:

20 - Sufficient number of terminals for connecting to external components and interfaces.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The compact package style saves space on the PCB and improves overall design aesthetics.

Maximum I (ol):

12 Amp - Capable of handling high output current, ensuring reliable performance in demanding applications.

Propagation Delay (tpd):

27 ns - Additional information on signal processing speed, indicating high efficiency.

Maximum Operating Temperature:

125 °C - High operating temperature range suitable for various environments.

Trigger Type:

POSITIVE EDGE - Specific trigger type for precise timing control in data processing.

Minimum Operating Temperature:

40 °C - Wide temperature range ensures operation in extreme conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Durable terminal finish for reliable connections and longevity.

Terminal Position:

DUAL - Dual terminal position for flexible installation options.

Maximum Seated Height:

1.2 mm - Low profile design for space-constrained applications.

Width:

4.4 mm - Compact width for efficient use of PCB space.

Output Polarity:

TRUE - Specific output polarity for accurate signal processing.

Minimum Supply Voltage (Vsup):

2 V - Wide supply voltage range for versatility in different power supply configurations.

Maximum Time At Peak Reflow Temperature (s):

30 - Reliable performance even during peak reflow conditions.

Peak Reflow Temperature °C:

260 - High peak reflow temperature tolerance for robust assembly processes.

Length:

6.5 mm - Compact length for space-saving design.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications with specific temperature requirements.

Maximum Frequency At Nominal Supply:

45,000,000 Hz - High-frequency capability for rapid signal processing.

Technology:

CMOS - CMOS technology for efficient and low-power operation.

Terminal Form:

GULL WING - Gull wing terminal form for easy soldering and reliable connections.

Packing Method:

TUBE - Convenient packing method for easy storage and handling.

Terminal Pitch:

0.65 mm - Optimal terminal pitch for precise connections.

Minimum fmax:

100 MHz - High minimum fmax for efficient signal processing.

Maximum Supply Voltage (Vsup):

5.5 V - Wide supply voltage range for flexibility in power supply options.

Maximum Power Supply Current (ICC):

0.02 mA - Low power supply current for energy-efficient operation.

Technical Specifications

Latches & Flip-Flops SN74LV273APWE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

100 MHz

Trade Compliance

SN74LV273APWE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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