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SN74LV244ATDGVRE4

Texas Instruments

SN74LV244ATDGVRE4 by Texas Instruments

SN74LV244ATDGVRE4 by Texas Instruments is a 2-function bus driver with 4 bits, operating at a nominal voltage of 5V. It features a propagation delay of 9.5ns and supports surface mount installation. Ideal for industrial applications requiring true output polarity and enable low control type in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,243 parts In-Stock

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Digiode

USA . 4,685 parts In-Stock

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4,685

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Distributors (Availability)

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AZTECH Wire

Italy . 338 parts In-Stock

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$15.263

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338

$15.263

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Parana Technologies

USA . 1,407 parts In-Stock

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$29.375

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$58.675

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1,407

$29.375

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$58.675

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DigiPath Technology Company

USA . 1,658 parts In-Stock

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$32.346

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$29.758

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1,658

$32.346

$29.758

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ChromeModa Solutions

Germany . 2,555 parts In-Stock

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$33.006

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$27.065

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2,555

$33.006

$27.065

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IDEA Electronic Components Group

UK . 862 parts In-Stock

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$33.006

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$31.356

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$29.705

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862

$33.006

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$29.705

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One Stop Electronics

USA . 774 parts In-Stock

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$39.000

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774

$39.000

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Andel Nordic

Denmark . 371 parts In-Stock

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$200.391

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$192.376

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$192.376

371

$200.391

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$192.376

Corphita

USA . 3,207 parts In-Stock

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Microchip USA

USA . 370 parts In-Stock

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Overview

Elevate your electronic projects with the SN74LV244ATDGVRE4 by Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Crafted from high-quality materials and advanced technology, this product offers unmatched reliability and precision. With fast propagation delay and 3-STATE output characteristics, it ensures seamless data transmission in industrial-grade applications. Experience the value of dual functions, true output polarity, and low power consumption. Trust Texas Instruments to deliver excellence in every aspect, from design to performance. Upgrade your projects with the SN74LV244ATDGVRE4 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and reduces the need for additional components, making the product cost-effective.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common nominal supply voltage of 5V makes the product compatible with a wide range of systems and power sources.

Maximum I (ol): 16 Amp

The high output current capability of 16A enables the product to drive heavy loads without the need for external amplifiers.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Using CMOS technology results in low power consumption and high noise immunity, enhancing the reliability and efficiency of the product.

Technical Specifications

Bus Driver & Transceivers SN74LV244ATDGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

Length:

5 mm

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV244ATDGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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