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SN74LV07APWRG4

Texas Instruments

SN74LV07APWRG4 by Texas Instruments

SN74LV07APWRG4 by Texas Instruments is a logic gate with 6 functions, 12 ns propagation delay, and open-drain output. It operates at a supply voltage of 2.5V to 3.3V and has a load capacitance of 50 pF. This component is ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

$0.295

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 880 parts In-Stock

1+ parts

$0.295

100+ parts

$0.271

1k+ parts

$0.265

10k+ parts

-

880

$0.295

$0.271

$0.265

-

Texas Instruments

USA . 4,950 parts In-Stock

1+ parts

$0.488

100+ parts

$0.332

1k+ parts

$0.170

10k+ parts

-

4,950

$0.488

$0.332

$0.170

-

Mouser Electronics

USA . 563 parts In-Stock

1+ parts

$0.660

100+ parts

$0.607

1k+ parts

$0.475

10k+ parts

$0.280

563

$0.660

$0.607

$0.475

$0.280

Chip1Stop

Japan . 1,645 parts In-Stock

1+ parts

-

100+ parts

$0.273

1k+ parts

$0.247

10k+ parts

$0.226

1,645

-

$0.273

$0.247

$0.226

Verical

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$0.271

1k+ parts

$0.265

10k+ parts

-

880

-

$0.271

$0.265

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 400 parts In-Stock

1+ parts

$0.229

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$0.229

-

-

-

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$0.229

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$0.229

-

-

-

Chip Stock

USA . 31,950 parts In-Stock

1+ parts

-

100+ parts

-

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31,950

-

-

-

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Vyrian

USA . 3,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,536

-

-

-

-

NPI Materials, Inc.

USA . 51 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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51

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,586 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

$0.178

-

-

-

Corphita

USA . 4,602 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

-

4,602

$0.217

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.225

100+ parts

-

1k+ parts

$0.216

10k+ parts

-

50

$0.225

-

$0.216

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Argo Parts USA

USA . 3,563 parts In-Stock

1+ parts

$0.229

100+ parts

-

1k+ parts

-

10k+ parts

$0.223

3,563

$0.229

-

-

$0.223

Continental Prestige Electronics

USA . 2,209 parts In-Stock

1+ parts

$0.229

100+ parts

-

1k+ parts

-

10k+ parts

$0.225

2,209

$0.229

-

-

$0.225

Parana Technologies

USA . 1,739 parts In-Stock

1+ parts

$12.146

100+ parts

$1,127.925

1k+ parts

$10.931

10k+ parts

-

1,739

$12.146

$1,127.925

$10.931

-

DigiPath Technology Company

USA . 642 parts In-Stock

1+ parts

$13.374

100+ parts

$12.304

1k+ parts

-

10k+ parts

-

642

$13.374

$12.304

-

-

ChromeModa Solutions

Germany . 5,287 parts In-Stock

1+ parts

$13.647

100+ parts

$11.191

1k+ parts

-

10k+ parts

-

5,287

$13.647

$11.191

-

-

IDEA Electronic Components Group

UK . 1,831 parts In-Stock

1+ parts

$13.647

100+ parts

$12.965

1k+ parts

$12.282

10k+ parts

-

1,831

$13.647

$12.965

$12.282

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Perfect Parts

USA . 13,952 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,952

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Microchip USA

USA . 3,978 parts In-Stock

1+ parts

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100+ parts

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3,978

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Overview

Unlock the power of seamless logic operations with the SN74LV07APWRG4 by Texas Instruments. Crafted with precision and expertise, this logic gate offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides a fast propagation delay, low power consumption, and compact design. Say goodbye to inefficiency and hello to seamless functionality with the SN74LV07APWRG4. Experience excellence in every operation with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast signal processing and efficient operation.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

No. of Functions: 6

Offers multiple functions in a single component, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for efficient performance and power consumption.

Load Capacitance (CL): 50 pF

Suitable for driving loads with optimal capacitance requirements.

Power Supplies (V): 3.3

Compatible with standard power supplies for easy integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving design for efficient PCB layout.

Maximum I (ol): 16 Amp

Capable of driving high current loads with ease.

Propagation Delay (tpd): 18 ns

Low propagation delay for fast signal processing and response time.

Maximum Operating Temperature: 125 °C

Suitable for automotive and industrial applications with high temperature requirements.

Output Characteristics: OPEN-DRAIN

Provides flexibility in circuit design and compatibility with various systems.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant terminal finish for long-term reliability.

Terminal Position: DUAL

Allows for versatile installation and connection options.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact width for efficient PCB layout and space optimization.

Minimum Supply Voltage (Vsup): 2 V

Wide operating voltage range for flexibility in power supply options.

Peak Reflow Temperature °C: 260

High reflow temperature support for reliable soldering and assembly.

Length: 5 mm

Compact length for space-saving integration into electronic systems.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliable performance in automotive applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and strong mechanical connection.

Packing Method: TR

Tape and reel packaging for convenient handling and automated assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high-density PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range for compatibility with different power sources.

Maximum Power Supply Current (ICC): 0.02 mA

Low power supply current for energy-efficient operation.

Technical Specifications

Logic Gates SN74LV07APWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV07APWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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