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SN74LV00APWTG4

Texas Instruments

SN74LV00APWTG4 by Texas Instruments

SN74LV00APWTG4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 13 ns at 2.5V, suitable for automotive applications due to its wide temperature range and small package size. With a max supply voltage of 5.5V and low power consumption of 0.02 mA, it is ideal for surface mount designs requiring fast response times.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,302 parts In-Stock

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Digiode

USA . 1,446 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 886 parts In-Stock

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Parana Technologies

USA . 2,267 parts In-Stock

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$15.231

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DigiPath Technology Company

USA . 616 parts In-Stock

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IDEA Electronic Components Group

UK . 1,514 parts In-Stock

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$15.403

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ChromeModa Solutions

Germany . 1,009 parts In-Stock

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$17.114

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$14.033

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Ampacity Inc.

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One Stop Electronics

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Continental Prestige Electronics

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Overview

Unlock the power of precise logic operations with the SN74LV00APWTG4 by Texas Instruments. Crafted with top-notch quality and expertise, this logic gate promises flawless performance in a variety of applications. From automotive to industrial settings, this versatile component offers unparalleled value, efficiency, and reliability. Experience seamless integration and superior results with Texas Instruments - the trusted choice for cutting-edge technology. Elevate your projects with the SN74LV00APWTG4 and enjoy the benefits of unmatched precision and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Propagation Delay At Nominal Supply: 13 ns

The low propagation delay ensures fast processing speeds, making this product ideal for time-critical applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

No. of Functions: 4

With four functions in one package, this product offers versatility and efficiency in circuit design.

No. of Inputs: 2

Two inputs provide flexibility for different logic operations, making this product suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for space-saving placement on circuit boards, maximizing efficiency in design layouts.

Nominal Supply Voltage / Vsup (V): 2.5

The low supply voltage requirement helps reduce power consumption, making this product energy-efficient.

Load Capacitance (CL): 50 pF

The load capacitance ensures stable performance in various circuit configurations, enhancing reliability.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration into existing systems seamless and straightforward.

No. of Terminals: 14

With 14 terminals, this product offers connectivity options for complex circuit designs, increasing versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design save space on the circuit board, allowing for compact and efficient designs.

Maximum I (ol): 12 Amp

The high output current capability makes this product suitable for driving external loads or connecting to other components.

Propagation Delay (tpd): 20 ns

Although slightly higher than at nominal supply, the propagation delay is still fast enough for quick response times in applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand harsh environmental conditions, ensuring reliability in challenging environments.

Output Characteristics: 3-STATE

The 3-state output allows for tristate logic operation, providing additional flexibility in logic design.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, making this product suitable for a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The finish on the terminals provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting options, accommodating different PCB layouts.

Maximum Seated Height: 1.2 mm

The low seated height enhances the product's compactness, making it suitable for slim devices and space-constrained applications.

Width: 4.4 mm

The narrow width allows for close placement of components on the circuit board, optimizing layout design and saving valuable space.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage requirement, this product can operate efficiently even at low power levels.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections during assembly, preventing issues related to solder joints.

Length: 5 mm

The compact length of the package makes it suitable for small-sized devices and applications with limited space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent quality and performance requirements for automotive electronics.

Technology: CMOS

Based on CMOS technology, this product offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder joints and easy handling during assembly, ensuring reliable connections.

Packing Method: TR

TR packaging method protects the product during transportation and storage, preventing damage and ensuring product integrity.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for a high-density layout on the PCB, maximizing space efficiency and component placement.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage tolerance, this product can withstand voltage spikes and fluctuations, ensuring stable operation.

Maximum Power Supply Current (ICC): 0.02 mA

The low power supply current requirement minimizes power consumption, making this product energy-efficient and cost-effective.

Technical Specifications

Logic Gates SN74LV00APWTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV00APWTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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