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SN74LS682DWR

Texas Instruments

SN74LS682DWR by Texas Instruments

SN74LS682DWR by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 30ns at 5V. It features inverted output polarity, Schmitt trigger technology, and operates within a temperature range of 0-70°C. Ideal for applications requiring fast arithmetic calculations in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,528 parts In-Stock

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Digiode

USA . 2,732 parts In-Stock

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Bristol Electronics

USA . 912 parts In-Stock

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912

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R&J Components

USA . 176 parts In-Stock

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Semtec, LLC

USA . 57 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,924 parts In-Stock

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$2.401

100+ parts

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$2.305

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$2.305

2,924

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$2.305

$2.305

AZTECH Wire

Italy . 425 parts In-Stock

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$7.150

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425

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Parana Technologies

USA . 1,131 parts In-Stock

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$23.162

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$23.796

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1,131

$23.162

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$23.796

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DigiPath Technology Company

USA . 2,356 parts In-Stock

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$25.504

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$23.464

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$25.504

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ChromeModa Solutions

Germany . 2,477 parts In-Stock

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$26.025

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$21.340

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2,477

$26.025

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IDEA Electronic Components Group

UK . 942 parts In-Stock

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$26.025

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$24.724

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$23.422

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942

$26.025

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$23.422

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One Stop Electronics

USA . 905 parts In-Stock

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$48.000

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905

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Microchip USA

USA . 10,052 parts In-Stock

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Corphita

USA . 2,228 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the SN74LS682DWR by Texas Instruments. Crafted with precision and quality materials, this product offers reliable performance with a propagation delay of 30ns at a nominal supply voltage of 5V. Perfect for a wide range of applications, including logic design and computer arithmetic, this versatile component provides customers with value and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the digital arithmetic circuits.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast processing speeds, making this product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

No. of Bits: 8

With 8 bits, this product can handle a wide range of numerical operations and calculations with precision.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most electronic systems and power sources.

Technical Specifications

Digital Arithmetic Circuits SN74LS682DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON B INPUTS; WITH A = B & A > B OUTPUTS

Family:

LS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuit

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.85 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74LS682DWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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