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SN74LS31NSRE4

Texas Instruments

SN74LS31NSRE4 by Texas Instruments

SN74LS31NSRE4 by Texas Instruments is a TTL technology delay line with 95 ns propagation delay at 5V. It has 16 terminals, operates b/w 0-70°C, and is surface mountable. Ideal for applications requiring true output polarity and a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,925 parts In-Stock

1+ parts

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5,925

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Digiode

USA . 2,814 parts In-Stock

1+ parts

-

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2,814

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$19.419

100+ parts

-

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460

$19.419

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One Stop Electronics

USA . 876 parts In-Stock

1+ parts

$23.000

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-

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876

$23.000

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Parana Technologies

USA . 530 parts In-Stock

1+ parts

$26.730

100+ parts

-

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$27.888

10k+ parts

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530

$26.730

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$27.888

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DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$29.433

100+ parts

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964

$29.433

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ChromeModa Solutions

Germany . 5,327 parts In-Stock

1+ parts

$30.034

100+ parts

$24.628

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5,327

$30.034

$24.628

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IDEA Electronic Components Group

UK . 29 parts In-Stock

1+ parts

$30.034

100+ parts

$28.532

1k+ parts

$27.031

10k+ parts

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29

$30.034

$28.532

$27.031

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Corphita

USA . 2,714 parts In-Stock

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2,714

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Overview

Enhance your electronic projects with the SN74LS31NSRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The SN74LS31NSRE4 belongs to the Delay Lines category, offering precise timing control for various applications. With a nominal supply voltage of 5V and a low propagation delay of 95ns, this component provides exceptional performance. Its small outline package design makes it easy to integrate into your circuit boards. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for accurate timing in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the delay line.

Propagation Delay At Nominal Supply: 95 ns

With a fast propagation delay of 95 ns at nominal supply voltage, this delay line ensures efficient signal processing and timing control.

Surface Mount: YES

Being surface mountable makes this delay line easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power supplies, making this delay line versatile for various applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this delay line can withstand elevated temperatures in demanding environments.

Technology: TTL

The TTL technology used in this delay line ensures reliable signal processing and compatibility with other TTL components in the circuit.

Technical Specifications

Delay Lines SN74LS31NSRE4 attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

95 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

95 ns

Width:

5.3 mm

Trade Compliance

SN74LS31NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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