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SN74HCT14DE4

Texas Instruments

SN74HCT14DE4 by Texas Instruments

SN74HCT14DE4 by Texas Instruments is a CMOS logic gate with 6 functions, 40 ns propagation delay at 5V. It features Schmitt Trigger technology, operates in industrial temperature range (-40 to 85 °C), and has a small outline package suitable for surface mount applications.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 496 parts In-Stock

1+ parts

$1.110

100+ parts

$0.768

1k+ parts

$0.501

10k+ parts

$0.427

496

$1.110

$0.768

$0.501

$0.427

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.577

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$0.577

-

-

-

Digiode

USA . 1,966 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

1,966

$1.054

-

-

-

Chip Stock

USA . 50,950 parts In-Stock

1+ parts

-

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50,950

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-

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Vyrian

USA . 2,648 parts In-Stock

1+ parts

-

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2,648

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Sensible Micro Corp

USA . 2,560 parts In-Stock

1+ parts

-

100+ parts

$0.215

1k+ parts

$0.200

10k+ parts

-

2,560

-

$0.215

$0.200

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,539 parts In-Stock

1+ parts

$0.577

100+ parts

-

1k+ parts

-

10k+ parts

$0.560

2,539

$0.577

-

-

$0.560

Continental Prestige Electronics

USA . 1,505 parts In-Stock

1+ parts

$0.577

100+ parts

-

1k+ parts

-

10k+ parts

$0.566

1,505

$0.577

-

-

$0.566

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.577

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.577

-

-

-

Ampacity Inc.

Singapore . 488 parts In-Stock

1+ parts

$0.940

100+ parts

-

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488

$0.940

-

-

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Corphita

USA . 4,276 parts In-Stock

1+ parts

$0.999

100+ parts

-

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4,276

$0.999

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-

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$15.260

100+ parts

-

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525

$15.260

-

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Parana Technologies

USA . 860 parts In-Stock

1+ parts

$19.680

100+ parts

-

1k+ parts

$19.673

10k+ parts

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860

$19.680

-

$19.673

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DigiPath Technology Company

USA . 1,934 parts In-Stock

1+ parts

$21.670

100+ parts

$19.936

1k+ parts

-

10k+ parts

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1,934

$21.670

$19.936

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ChromeModa Solutions

Germany . 4,966 parts In-Stock

1+ parts

$22.112

100+ parts

$18.132

1k+ parts

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10k+ parts

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4,966

$22.112

$18.132

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IDEA Electronic Components Group

UK . 1,597 parts In-Stock

1+ parts

$22.112

100+ parts

$21.006

1k+ parts

$19.901

10k+ parts

-

1,597

$22.112

$21.006

$19.901

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Perfect Parts

USA . 3,034 parts In-Stock

1+ parts

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3,034

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Microchip USA

USA . 1,782 parts In-Stock

1+ parts

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1,782

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Infinite Electronics LLP (Excess)

. 987 parts In-Stock

1+ parts

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987

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Formix International (Excess)

India . 400 parts In-Stock

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400

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Overview

Discover the cutting-edge SN74HCT14DE4 by Texas Instruments, a high-quality Logic Gates product designed to meet your electronic needs with precision and reliability. With Texas Instruments' renowned reputation for excellence in manufacturing, this device offers unparalleled performance and durability. Ideal for a wide range of applications, this product boasts a fast propagation delay of 40 ns, ensuring efficient signal processing. Experience the value and benefits of this innovative technology, providing you with the advantage you need to excel in your projects. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Propagation Delay At Nominal Supply: 40 ns

Fast propagation delay ensures quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V allows for compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, this product can effectively drive connected components without risk of voltage drops.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this product suitable for use in industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Logic Gates SN74HCT14DE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HCT14DE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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