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SN74HC175DG4

Texas Instruments

SN74HC175DG4 by Texas Instruments

SN74HC175DG4 by Texas Instruments is a 4-bit latch with 38ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 5V, has a load capacitance of 50pF, and can handle a max power supply current of 0.08mA. This CMOS technology flip-flop has a trigger type of positive edge and can reach a max frequency of 25MHz.

Median Price

$0.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 475 parts In-Stock

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$0.940

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$0.395

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$0.321

475

$0.940

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$0.395

$0.321

Distributors (In-Stock)

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Digiode

USA . 4,902 parts In-Stock

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$0.893

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4,902

$0.893

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Chip Stock

USA . 10,030 parts In-Stock

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Vyrian

USA . 6,203 parts In-Stock

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Bristol Electronics

USA . 58 parts In-Stock

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M&R Communications

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Distributors (Availability)

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Corphita

USA . 4,820 parts In-Stock

1+ parts

$0.846

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4,820

$0.846

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

$15.514

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$15.889

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868

$15.514

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$15.889

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DigiPath Technology Company

USA . 211 parts In-Stock

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$17.083

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211

$17.083

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ChromeModa Solutions

Germany . 1,868 parts In-Stock

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$17.432

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$14.294

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1,868

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IDEA Electronic Components Group

UK . 940 parts In-Stock

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$17.432

100+ parts

$16.560

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$15.689

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940

$17.432

$16.560

$15.689

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Component Stockers USA

USA . 397 parts In-Stock

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$99.990

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Perfect Parts

USA . 2,374 parts In-Stock

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Microchip USA

USA . 1,118 parts In-Stock

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Overview

Upgrade your electronic designs with the SN74HC175DG4 by Texas Instruments! This high-quality latch flip-flop offers superior performance and reliability, thanks to its trusted manufacturer. Ideal for a variety of applications in the latches and flip-flops category, this product provides exceptional value and benefits to customers. With fast propagation delays and a wide operating temperature range, the SN74HC175DG4 is a versatile solution for your next project. Trust Texas Instruments for top-notch quality and innovation in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 38 ns

The low propagation delay ensures fast response and efficient operation of the latch & flip-flop.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

No. of Bits: 4

With 4 bits, this latch & flip-flop can store and process multiple binary data efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard electronic systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance helps in stabilizing the signals and reducing noise interference in the circuit.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures the reliability and stability of the latch & flip-flop in harsh environments.

Maximum Frequency At Nominal Supply: 25000000 Hz

With a high maximum frequency, this latch & flip-flop can handle high-speed data processing and clocking operations effectively.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this latch & flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops SN74HC175DG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.91 mm

Minimum fmax:

29 MHz

Trade Compliance

SN74HC175DG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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