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SN74HC148DRE4

Texas Instruments

SN74HC148DRE4 by Texas Instruments

SN74HC148DRE4 by Texas Instruments is a CMOS encoder with 8 bits and a propagation delay of 49 ns. It operates at a nominal voltage of 5V and has a small outline package style, making it suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 42,754 parts In-Stock

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Digiode

USA . 4,935 parts In-Stock

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4,935

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Vyrian

USA . 2,583 parts In-Stock

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Distributors (Availability)

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Andel Nordic

Denmark . 260 parts In-Stock

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$3.872

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-

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$3.718

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$3.718

260

$3.872

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$3.718

$3.718

One Stop Electronics

USA . 1,375 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 282 parts In-Stock

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$9.826

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$9.826

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Parana Technologies

USA . 2,111 parts In-Stock

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$19.897

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$19.851

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2,111

$19.897

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$19.851

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ChromeModa Solutions

Germany . 3,516 parts In-Stock

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$22.356

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$18.332

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$22.356

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IDEA Electronic Components Group

UK . 1,168 parts In-Stock

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$22.356

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$21.238

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$20.120

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$22.356

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$20.120

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Ampacity Inc.

Singapore . 1,140 parts In-Stock

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$65.000

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Corphita

USA . 4,313 parts In-Stock

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Microchip USA

USA . 2,756 parts In-Stock

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DigiPath Technology Company

USA . 1,100 parts In-Stock

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$20.156

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the power of quality with the SN74HC148DRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you reliable and innovative digital arithmetic circuits. The SN74HC148DRE4, an 8-bit encoder, offers unparalleled value and benefits to customers. With its fast propagation delay and high-performance capabilities, this product is perfect for a range of applications. Whether you're designing industrial equipment or working on a high-tech project, trust in the quality and advantages that the SN74HC148DRE4 has to offer. Unlock endless possibilities with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 49 ns

Offers fast processing speed, ideal for high-speed digital arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to integrate into existing systems.

No. of Bits: 8

Provides a suitable resolution for digital arithmetic operations, balancing cost and performance.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring stability in harsh operating environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits SN74HC148DRE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

49 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC148DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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