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SN74GTLP21395PWE4

Texas Instruments

SN74GTLP21395PWE4 by Texas Instruments

SN74GTLP21395PWE4 by Texas Instruments is a Bus Driver & Transceiver with 2 functions, operating at 3.3V. It features a propagation delay of 10.4ns, output polarity is configurable and has a max power supply current of 20mA. Ideal for industrial applications requiring bidirectional control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,790 parts In-Stock

1+ parts

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5,790

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Digiode

USA . 1,068 parts In-Stock

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1,068

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Distributors (Availability)

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Andel Nordic

Denmark . 389 parts In-Stock

1+ parts

$8.779

100+ parts

-

1k+ parts

$8.428

10k+ parts

$8.428

389

$8.779

-

$8.428

$8.428

One Stop Electronics

USA . 795 parts In-Stock

1+ parts

$10.000

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-

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795

$10.000

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AZTECH Wire

Italy . 852 parts In-Stock

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$16.729

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852

$16.729

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$26.825

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$28.975

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2,168

$26.825

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$28.975

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DigiPath Technology Company

USA . 1,593 parts In-Stock

1+ parts

$29.538

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1,593

$29.538

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ChromeModa Solutions

Germany . 1,943 parts In-Stock

1+ parts

$30.141

100+ parts

$24.716

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1,943

$30.141

$24.716

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IDEA Electronic Components Group

UK . 1,813 parts In-Stock

1+ parts

$30.141

100+ parts

$28.634

1k+ parts

$27.127

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1,813

$30.141

$28.634

$27.127

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Corphita

USA . 4,778 parts In-Stock

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4,778

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Microchip USA

USA . 432 parts In-Stock

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432

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Overview

Enhance your electronic designs with the SN74GTLP21395PWE4 by Texas Instruments. This high-quality bus driver & transceiver offers reliable translation between GTLP & LVTTL, making it perfect for a wide range of applications. With its compact design and industrial-grade temperature tolerance, this product provides exceptional value and performance. Upgrade your projects today with the innovative technology and trusted reputation of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the bus driver & transceivers.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently at a common supply voltage, ensuring compatibility with a wide range of systems.

Maximum I (ol): 100 Amp

Capable of handling high output currents, making it suitable for demanding applications.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal, allowing for tri-state logic which is useful in bus systems.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption, high noise immunity, and compatibility with various logic levels.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating temperatures, ensuring reliability in harsh environments.

Technical Specifications

Bus Driver & Transceivers SN74GTLP21395PWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

100 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

10.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTLP & LVTTL

Width:

4.4 mm

Trade Compliance

SN74GTLP21395PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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