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SN74F373DWG4

Texas Instruments

SN74F373DWG4 by Texas Instruments

SN74F373DWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 8ns at 5V. It features a small outline package, 3-STATE output characteristics, and operates within a temperature range of 0 to 70°C. Ideal for applications requiring true output polarity control in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,154 parts In-Stock

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Digiode

USA . 1,212 parts In-Stock

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1,212

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Distributors (Availability)

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Andel Nordic

Denmark . 5,141 parts In-Stock

1+ parts

$4.834

100+ parts

-

1k+ parts

$4.641

10k+ parts

$4.641

5,141

$4.834

-

$4.641

$4.641

AZTECH Wire

Italy . 898 parts In-Stock

1+ parts

$16.492

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898

$16.492

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Parana Technologies

USA . 687 parts In-Stock

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$25.201

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-

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$25.846

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687

$25.201

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$25.846

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DigiPath Technology Company

USA . 827 parts In-Stock

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$27.750

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827

$27.750

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ChromeModa Solutions

Germany . 1,356 parts In-Stock

1+ parts

$28.316

100+ parts

$23.219

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1,356

$28.316

$23.219

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IDEA Electronic Components Group

UK . 827 parts In-Stock

1+ parts

$28.316

100+ parts

$26.900

1k+ parts

$25.484

10k+ parts

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827

$28.316

$26.900

$25.484

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One Stop Electronics

USA . 1,221 parts In-Stock

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$30.000

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$30.000

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Component Stockers USA

USA . 369 parts In-Stock

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$99.990

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369

$99.990

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Microchip USA

USA . 2,299 parts In-Stock

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2,299

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Corphita

USA . 1,558 parts In-Stock

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Perfect Parts

USA . 1,092 parts In-Stock

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Overview

Unlock seamless data transmission and reliable performance with the SN74F373DWG4 by Texas Instruments. Known for their top-notch quality and innovative solutions, Texas Instruments delivers a cutting-edge Bus Driver & Transceiver that excels in various applications. This versatile product offers customers unparalleled value, benefits, and advantages, making it a must-have for any project requiring efficient data transfer and exceptional reliability. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for transportation and rugged environments.

Propagation Delay At Nominal Supply: 8 ns

The low propagation delay ensures fast and efficient communication within the system, reducing latency and improving overall performance.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving space and simplifying assembly.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission, making the product suitable for various applications that require multiple signals to be processed simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and provides a stable power source for reliable performance.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate control, enabling the bus driver to effectively manage multiple signal lines with high impedance when not actively transmitting data.

Technical Specifications

Bus Driver & Transceivers SN74F373DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74F373DWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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