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SN74F244DWRG4

Texas Instruments

SN74F244DWRG4 by Texas Instruments

SN74F244DWRG4 by Texas Instruments is a 20-terminal bus driver with 6.5 ns propagation delay at 5V, suitable for TTL technology applications. It features 3-STATE output characteristics and enables low control type, making it ideal for driving buses in commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,861 parts In-Stock

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Digiode

USA . 833 parts In-Stock

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Bristol Electronics

USA . 40 parts In-Stock

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40

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Component Sense

UK . 20 parts In-Stock

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20

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AZTECH Wire

Italy . 510 parts In-Stock

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$7.525

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510

$7.525

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Parana Technologies

USA . 1,173 parts In-Stock

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$22.448

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$2,084.681

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$20.204

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DigiPath Technology Company

USA . 375 parts In-Stock

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$24.719

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$22.741

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$24.719

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IDEA Electronic Components Group

UK . 1,316 parts In-Stock

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$25.223

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$23.962

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$22.701

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$25.223

$23.962

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ChromeModa Solutions

Germany . 307 parts In-Stock

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$25.223

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$20.683

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One Stop Electronics

USA . 1,463 parts In-Stock

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$51.000

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Corphita

USA . 2,123 parts In-Stock

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Microchip USA

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Overview

Get ready to experience top-quality performance with the SN74F244DWRG4 by Texas Instruments, a leading manufacturer in the industry. With applications in Bus Driver & Transceivers, this product offers exceptional value and benefits to customers. Enjoy fast propagation delay, easy surface mounting, and reliable output characteristics that make this product a must-have for your electronic projects. Trust in Texas Instruments to deliver excellence with every component, and elevate your designs with the SN74F244DWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 6.5 ns

Offers fast signal transmission, ensuring efficient performance of the product.

Surface Mount: YES

Facilitates easy installation and saves space on the PCB.

No. of Functions: 2

Allows the product to perform multiple functions efficiently.

Nominal Supply Voltage / Vsup (V): 5

Works well within the standard voltage range, ensuring compatibility with various systems.

Load Capacitance (CL): 50 pF

Supports efficient signal transmission and reception with the specified load capacitance.

Power Supplies (V): 5

Operates effectively with the standard power supply voltage.

No. of Terminals: 20

Provides multiple connection points for easy integration into the system.

Maximum I (ol): 64 Amp

Capable of handling high output current, ensuring reliability under load.

Temperature Grade: COMMERCIAL

Meets commercial temperature standards for reliable operation in various environments.

Technical Specifications

Bus Driver & Transceivers SN74F244DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74F244DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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