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SN74CBTD3384CDWRG4

Texas Instruments

SN74CBTD3384CDWRG4 by Texas Instruments

SN74CBTD3384CDWRG4 by Texas Instruments is a 10-bit bus driver with 0.15 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. This CMOS technology device features dual terminal position and true output polarity in a small outline package.

Median Price

$0.603

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$0.603

100+ parts

$0.464

1k+ parts

$0.244

10k+ parts

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5,950

$0.603

$0.464

$0.244

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,399 parts In-Stock

1+ parts

$0.573

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-

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3,399

$0.573

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Vyrian

USA . 5,721 parts In-Stock

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5,721

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,837 parts In-Stock

1+ parts

$0.510

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-

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5,837

$0.510

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Corphita

USA . 2,238 parts In-Stock

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$0.543

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2,238

$0.543

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AZTECH Wire

Italy . 608 parts In-Stock

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$13.160

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608

$13.160

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Parana Technologies

USA . 465 parts In-Stock

1+ parts

$28.704

100+ parts

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$50.782

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465

$28.704

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$50.782

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DigiPath Technology Company

USA . 1,195 parts In-Stock

1+ parts

$31.607

100+ parts

$29.078

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1,195

$31.607

$29.078

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ChromeModa Solutions

Germany . 2,427 parts In-Stock

1+ parts

$32.252

100+ parts

$26.447

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2,427

$32.252

$26.447

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IDEA Electronic Components Group

UK . 1,590 parts In-Stock

1+ parts

$32.252

100+ parts

$30.639

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$29.027

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1,590

$32.252

$30.639

$29.027

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Microchip USA

USA . 1,480 parts In-Stock

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1,480

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Aranea Global

USA . 500 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality SN74CBTD3384CDWRG4 bus driver & transceiver by Texas Instruments. This versatile component is designed to provide efficient signal transmission with minimal propagation delay, making it perfect for a wide range of applications. With Texas Instruments' reputation for reliability and innovation, you can trust that this product will deliver exceptional performance. Upgrade your projects today and experience the value and advantages that the SN74CBTD3384CDWRG4 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a longer lifespan for the bus driver/transceiver.

Propagation Delay At Nominal Supply: 0.15 ns

The low propagation delay ensures efficient and fast communication within the bus driver/transceiver, leading to improved overall performance.

Surface Mount: YES

Being surface mountable makes the installation of the bus driver/transceiver simple and convenient, saving time and effort during setup.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high flexibility in controlling the bus driver/transceiver's output, enhancing its versatility in various applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the bus driver/transceiver can operate efficiently in harsh environmental conditions, making it suitable for a wide range of industrial applications.

Technology: CMOS

The CMOS technology used in the bus driver/transceiver ensures low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Control Type: ENABLE LOW

The enable low control type allows for easy activation and deactivation of the bus driver/transceiver, facilitating seamless integration into various systems and circuits.

Technical Specifications

Bus Driver & Transceivers SN74CBTD3384CDWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.365 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.5 mA

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74CBTD3384CDWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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