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SN74BCT757DWE4

Texas Instruments

SN74BCT757DWE4 by Texas Instruments

SN74BCT757DWE4 by Texas Instruments is a Bus Driver & Transceiver with 2 functions, 4 bits, and 20 terminals. It has a propagation delay of 6.6 ns at nominal voltage of 5V. Ideal for applications requiring open-collector output characteristics and true output polarity in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,710 parts In-Stock

1+ parts

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2,710

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Digiode

USA . 2,134 parts In-Stock

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2,134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,235 parts In-Stock

1+ parts

$1.779

100+ parts

-

1k+ parts

$1.708

10k+ parts

$1.708

4,235

$1.779

-

$1.708

$1.708

AZTECH Wire

Italy . 794 parts In-Stock

1+ parts

$12.550

100+ parts

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794

$12.550

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One Stop Electronics

USA . 130 parts In-Stock

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$24.000

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130

$24.000

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Parana Technologies

USA . 497 parts In-Stock

1+ parts

$28.938

100+ parts

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$53.426

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497

$28.938

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$53.426

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DigiPath Technology Company

USA . 1,572 parts In-Stock

1+ parts

$31.865

100+ parts

$29.316

1k+ parts

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10k+ parts

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1,572

$31.865

$29.316

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ChromeModa Solutions

Germany . 5,208 parts In-Stock

1+ parts

$32.515

100+ parts

$26.662

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5,208

$32.515

$26.662

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IDEA Electronic Components Group

UK . 38 parts In-Stock

1+ parts

$32.515

100+ parts

$30.889

1k+ parts

$29.264

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38

$32.515

$30.889

$29.264

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$45.000

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139

$45.000

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Component Stockers USA

USA . 366 parts In-Stock

1+ parts

$99.990

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366

$99.990

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Microchip USA

USA . 1,563 parts In-Stock

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1,563

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Corphita

USA . 238 parts In-Stock

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Overview

Trust in Texas Instruments to deliver top-notch quality with the SN74BCT757DWE4 Bus Driver & Transceivers. This versatile component boasts reliable performance and seamless integration, making it ideal for a wide range of applications. With its advanced technology and durable construction, this product ensures optimal functionality and efficiency. Experience the value and benefits that Texas Instruments brings to the table with the SN74BCT757DWE4 - the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, ensuring the product can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 9.6 ns

Low propagation delay ensures quick signal transmission, making the product efficient for high-speed data transmission.

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic circuits, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one component saves board space and reduces the overall system complexity.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts, making it easier for design implementation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common electronic systems.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other electronics and devices, enhancing flexibility in system design.

Technology: BICMOS

Utilizing BiCMOS technology offers a combination of high-speed performance and low power consumption, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74BCT757DWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TRISTATE CONTROL INPUT ACTIVE HIGH FOR ONE FUNCTION

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay At Nominal Supply:

9.6 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74BCT757DWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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