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SN74BCT543DWR

Texas Instruments

SN74BCT543DWR by Texas Instruments

SN74BCT543DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.6 ns at 5V, suitable for bidirectional applications. It features a max I (ol) of 64A, operates b/w 0-70°C, and has independent control with a terminal pitch of 1.27mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 7,466 parts In-Stock

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Bristol Electronics

USA . 2,629 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,828 parts In-Stock

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Dan-Mar Components

USA . 1,828 parts In-Stock

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Digiode

USA . 1,517 parts In-Stock

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Andel Nordic

Denmark . 846 parts In-Stock

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$8.963

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$8.604

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$8.604

846

$8.963

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$8.604

AZTECH Wire

Italy . 476 parts In-Stock

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$10.040

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Parana Technologies

USA . 2,170 parts In-Stock

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$17.308

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$17.519

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DigiPath Technology Company

USA . 699 parts In-Stock

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$19.058

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$17.533

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ChromeModa Solutions

Germany . 5,542 parts In-Stock

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$19.447

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$15.947

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IDEA Electronic Components Group

UK . 966 parts In-Stock

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$19.447

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$18.475

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$17.502

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One Stop Electronics

USA . 985 parts In-Stock

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$32.000

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Component Stockers USA

USA . 502 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 9,255 parts In-Stock

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Kepictronics

USA . 5,965 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the SN74BCT543DWR Bus Driver & Transceiver by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers a product that offers unparalleled performance in a wide range of applications. This 8-bit transceiver is designed to provide seamless data transmission while ensuring a quick propagation delay at nominal supply voltage. With a compact package style and surface mount capability, this product is perfect for space-constrained projects. Experience the value and benefits of the SN74BCT543DWR today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to environmental conditions, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 9.6 ns

The low propagation delay ensures fast and efficient communication within the bus driver/transceiver, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common in many electronic systems, making it compatible with a wide range of applications.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in connecting the transceiver to other components, making it versatile for different setups.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand temperature variations and perform reliably in different environments.

Output Characteristics: 3-STATE

The 3-state output allows the transceiver to have multiple output states, providing flexibility in controlling the data flow within the bus system.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption for efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74BCT543DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; MASTER CONTROL FOR LATCH

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

71 mA

Propagation Delay At Nominal Supply:

9.6 ns

Propagation Delay (tpd):

12.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74BCT543DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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