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SN74BCT29843NT

Texas Instruments

SN74BCT29843NT by Texas Instruments

SN74BCT29843NT by Texas Instruments is a 9-bit bus driver with 3-STATE output characteristics. It operates at a nominal voltage of 5V, has a propagation delay of 10ns, and can handle a max power supply current of 35mA. This IC is commonly used in applications requiring efficient signal transmission and control within electronic systems.

Median Price

$2.170

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.170

10k+ parts

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825

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$2.170

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Verical

USA . 825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.225

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-

825

-

-

$2.225

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Rochester

USA . 75 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

75

-

$1.890

$1.690

$1.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 80 parts In-Stock

1+ parts

$1.986

100+ parts

-

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80

$1.986

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Vyrian

USA . 6,016 parts In-Stock

1+ parts

-

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6,016

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DigiKey Marketplace

USA . 825 parts In-Stock

1+ parts

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825

-

-

-

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Bristol Electronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.673

1k+ parts

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120

-

$1.673

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Microfarads

USA . 116 parts In-Stock

1+ parts

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116

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Halfin

Belgium . 30 parts In-Stock

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30

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R&J Components

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 495 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

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10k+ parts

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495

$1.881

-

-

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Andel Nordic

Denmark . 1,508 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

$2.640

10k+ parts

$2.640

1,508

$2.750

-

$2.640

$2.640

Parana Technologies

USA . 918 parts In-Stock

1+ parts

$25.992

100+ parts

-

1k+ parts

$26.583

10k+ parts

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918

$25.992

-

$26.583

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DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$28.621

100+ parts

$26.331

1k+ parts

-

10k+ parts

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1,657

$28.621

$26.331

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$29.205

100+ parts

$27.745

1k+ parts

$26.284

10k+ parts

-

2,298

$29.205

$27.745

$26.284

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ChromeModa Solutions

Germany . 2,182 parts In-Stock

1+ parts

$29.205

100+ parts

$23.948

1k+ parts

-

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2,182

$29.205

$23.948

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Microchip USA

USA . 226 parts In-Stock

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226

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J Silver Components DBA - Lantern Electronics

USA . 22 parts In-Stock

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22

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Overview

Elevate your electronic designs with the SN74BCT29843NT by Texas Instruments, a high-quality bus driver and transceiver that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product ensures superior functionality and durability. Ideal for a wide range of applications, this compact rectangular package delivers fast propagation delay and 3-state output characteristics, making it perfect for demanding projects where speed and efficiency are essential. Trust Texas Instruments to provide cutting-edge technology that enhances your designs – explore the possibilities with the SN74BCT29843NT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that enhances product reliability and longevity.

Propagation Delay At Nominal Supply: 9 ns

Fast propagation delay ensures quick and efficient data transmission.

No. of Bits: 9

Supports communication over multiple bits, allowing for more complex data transmission.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used and stable supply voltage for ease of integration.

Load Capacitance (CL): 50 pF

Optimized load capacitance for efficient signal transmission and reception.

Maximum I (ol): 48 Amp

High output current capability for driving external loads.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures reliable performance in various environments.

Technology: BICMOS

Utilizes advanced BICMOS technology for efficient power consumption and high-speed operation.

Maximum Power Supply Current (ICC): 35 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74BCT29843NT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND PRESET

Family:

BCT/FBT

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

9

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74BCT29843NT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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