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SN74AUP2G80RSER

Texas Instruments

SN74AUP2G80RSER by Texas Instruments

SN74AUP2G80RSER by Texas Instruments is a CMOS latch with 28.7 ns propagation delay, suitable for industrial applications. It operates at 1.2/3.3V with 30pF load capacitance and has a max frequency of 80MHz, making it ideal for high-speed circuit designs. With a compact square package style and surface mount capability, this chip carrier is designed for space-constrained environments.

Median Price

$0.564

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 189,000 parts In-Stock

1+ parts

$0.608

100+ parts

$0.467

1k+ parts

$0.246

10k+ parts

-

189,000

$0.608

$0.467

$0.246

-

Rochester

USA . 108,202 parts In-Stock

1+ parts

-

100+ parts

$0.501

1k+ parts

$0.416

10k+ parts

$0.371

108,202

-

$0.501

$0.416

$0.371

DigiKey

USA . 108,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

-

108,202

-

-

$0.630

-

Verical

USA . 108,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.520

10k+ parts

$0.463

108,202

-

-

$0.520

$0.463

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,461 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$0.325

-

-

-

Vyrian

USA . 5,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,395

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,649 parts In-Stock

1+ parts

$0.308

100+ parts

-

1k+ parts

-

10k+ parts

-

1,649

$0.308

-

-

-

Parana Technologies

USA . 1,248 parts In-Stock

1+ parts

$18.779

100+ parts

-

1k+ parts

$18.864

10k+ parts

-

1,248

$18.779

-

$18.864

-

DigiPath Technology Company

USA . 1,861 parts In-Stock

1+ parts

$20.678

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

$20.678

-

-

-

AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$21.010

100+ parts

-

1k+ parts

-

10k+ parts

-

568

$21.010

-

-

-

IDEA Electronic Components Group

UK . 1,587 parts In-Stock

1+ parts

$21.100

100+ parts

$20.045

1k+ parts

$18.990

10k+ parts

-

1,587

$21.100

$20.045

$18.990

-

ChromeModa Solutions

Germany . 1,261 parts In-Stock

1+ parts

$21.100

100+ parts

$17.302

1k+ parts

-

10k+ parts

-

1,261

$21.100

$17.302

-

-

Perfect Parts

USA . 6,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,173

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Overview

Enhance your electronic projects with the SN74AUP2G80RSER by Texas Instruments, a high-quality latch & flip-flop device perfect for a wide range of applications. With Texas Instruments' reputation for innovation and reliability, you can trust this product to deliver superior performance. Experience fast propagation delay, low power consumption, and a compact design that fits seamlessly into your projects. Unlock new possibilities in your designs with the value and benefits that this versatile component offers.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 28.7 ns

Low propagation delay ensures fast operation and high performance.

Surface Mount: YES

Surface mount capability makes installation and integration easier.

No. of Functions: 2

Having multiple functions in one device can save space and simplify circuit design.

Nominal Supply Voltage / Vsup (V): 1.2

Low nominal supply voltage helps in reducing power consumption.

Maximum I (ol): 4 Amp

High maximum output current allows for driving of heavy loads.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise control of timing in the circuit.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops SN74AUP2G80RSER attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.0009 mA

Propagation Delay At Nominal Supply:

28.7 ns

Propagation Delay (tpd):

28.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.5 mm

Minimum fmax:

260 MHz

Trade Compliance

SN74AUP2G80RSER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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