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SN74AUP1G80DCKRE4

Texas Instruments

SN74AUP1G80DCKRE4 by Texas Instruments

SN74AUP1G80DCKRE4 by Texas Instruments is a latches & flip-flops IC with 28.7 ns propagation delay at 1.2V, suitable for industrial applications. It features a small outline package, operates b/w -40 to 85°C, and supports a max frequency of 260MHz at 3.6V supply voltage.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,666 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

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Component Stockers USA

USA . 167,842 parts In-Stock

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$0.840

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Corohmni

South Africa . 343 parts In-Stock

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$12.454

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Ampacity Inc.

Singapore . 273 parts In-Stock

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$17.000

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AZTECH Wire

Italy . 769 parts In-Stock

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Parana Technologies

USA . 2,151 parts In-Stock

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$23.379

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$24.013

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ChromeModa Solutions

Germany . 2,086 parts In-Stock

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$26.268

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$21.540

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

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$24.955

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$23.641

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One Stop Electronics

USA . 1,400 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Perfect Parts

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Argo Parts USA

USA . 3,615 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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Aranea Global

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Overview

Unlock a world of possibilities with the SN74AUP1G80DCKRE4 by Texas Instruments. Manufactured with precision and expertise, this latch & flip-flop device offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with seamless operation and exceptional performance. With a nominal supply voltage of 1.2V and a maximum operating temperature of 85°C, this compact and versatile component is designed to meet your needs. Experience the value and advantages that only Texas Instruments can deliver with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental elements, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 28.7 ns

The low propagation delay ensures fast and efficient operation, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low supply voltage of 1.2V, making it energy-efficient and suitable for battery-powered devices.

Load Capacitance (CL): 30 pF

The low load capacitance reduces power consumption and ensures stable performance in various circuit configurations.

Power Supplies (V): 1.2/3.3

Supports multiple power supply voltages, offering flexibility for different system requirements.

No. of Terminals: 5

Compact design with a minimal number of terminals simplifies integration and reduces overall footprint.

Maximum I (ol): 4 Amp

High maximum output current capability allows for driving of larger loads, increasing versatility in circuit design.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures reliable and precise operation in synchronous systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages.

Technical Specifications

Latches & Flip-Flops SN74AUP1G80DCKRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

260000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.0009 mA

Propagation Delay At Nominal Supply:

28.7 ns

Propagation Delay (tpd):

28.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

260 MHz

Trade Compliance

SN74AUP1G80DCKRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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