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SN74AUC2G80DCURE4

Texas Instruments

SN74AUC2G80DCURE4 by Texas Instruments

SN74AUC2G80DCURE4 by Texas Instruments is a latches & flip-flops IC with 3.9 ns propagation delay, suitable for industrial applications. It operates at 1.2V supply voltage, offers 2 functions in a small outline package, and supports a max frequency of 275 MHz. Ideal for systems requiring fast signal processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,756 parts In-Stock

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Digiode

USA . 3,904 parts In-Stock

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3,904

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Distributors (Availability)

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AZTECH Wire

Italy . 593 parts In-Stock

1+ parts

$7.511

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593

$7.511

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Parana Technologies

USA . 806 parts In-Stock

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$7.739

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$8.274

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806

$7.739

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$8.274

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DigiPath Technology Company

USA . 853 parts In-Stock

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$8.522

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$7.840

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853

$8.522

$7.840

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ChromeModa Solutions

Germany . 2,145 parts In-Stock

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$8.696

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$7.131

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$8.696

$7.131

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

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$8.696

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$8.261

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$7.826

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$8.696

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$7.826

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One Stop Electronics

USA . 959 parts In-Stock

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$50.000

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$50.000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,722 parts In-Stock

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Microchip USA

USA . 4,693 parts In-Stock

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Corphita

USA . 4,177 parts In-Stock

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Overview

Unlock the power of reliable performance with the SN74AUC2G80DCURE4 by Texas Instruments. Designed with precision and quality in mind, this latches & flip-flops device offers fast propagation delay and versatile functionality for various applications. With a compact design and advanced technology, this product ensures seamless operations and enhanced efficiency. Trust Texas Instruments to deliver top-notch solutions that exceed expectations and elevate your projects to new heights. Experience the difference with the SN74AUC2G80DCURE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 3.9 ns

With a low propagation delay, this latch or flip-flop ensures fast response times and efficient operation in timing-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier and more convenient.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low nominal supply voltage of 1.2V makes this latch or flip-flop energy-efficient.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in connecting multiple devices to the output without causing conflicts.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate and reliable operation by triggering the latch or flip-flop at the rising edge of the clock signal.

Maximum Frequency At Nominal Supply: 200000000 Hz

With a high maximum frequency, this latch or flip-flop can handle fast data transfer rates and high-speed applications effectively.

Technical Specifications

Latches & Flip-Flops SN74AUC2G80DCURE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC2G80DCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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