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SN74AUC1G79DCKRE4

Texas Instruments

SN74AUC1G79DCKRE4 by Texas Instruments

SN74AUC1G79DCKRE4 by Texas Instruments is a latches & flip-flops IC with 3.9 ns propagation delay, operating at 1.2V supply voltage. It features a small outline package and is suitable for applications requiring positive edge trigger and 3-STATE output characteristics at industrial temperature grades up to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,742 parts In-Stock

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Digiode

USA . 2,948 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,306 parts In-Stock

1+ parts

$9.000

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1,306

$9.000

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Parana Technologies

USA . 71 parts In-Stock

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$15.575

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$15.950

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71

$15.575

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$15.950

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DigiPath Technology Company

USA . 436 parts In-Stock

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$17.150

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436

$17.150

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ChromeModa Solutions

Germany . 3,981 parts In-Stock

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$17.500

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$14.350

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3,981

$17.500

$14.350

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IDEA Electronic Components Group

UK . 375 parts In-Stock

1+ parts

$17.500

100+ parts

$16.625

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$15.750

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375

$17.500

$16.625

$15.750

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AZTECH Wire

Italy . 564 parts In-Stock

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$17.589

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Microchip USA

USA . 1,086 parts In-Stock

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Corphita

USA . 405 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74AUC1G79DCKRE4 Latch & Flip-Flop. This versatile component offers fast propagation delay, low power consumption, and a wide range of applications in various industries. With a compact design and advanced technology, this product provides customers with exceptional performance and value. Trust in Texas Instruments for innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures fast response time and efficient operation.

Surface Mount: YES

Surface mount design makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.2

Optimal supply voltage for reliable performance and compatibility with other components.

Load Capacitance (CL): 15 pF

Suitable load capacitance for stable operation and reduced signal distortion.

Maximum I (ol): 9 Amp

High output current capacity allows for driving of more demanding loads.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal, allowing for tri-state logic.

Trigger Type: POSITIVE EDGE

Positive edge trigger simplifies timing requirements and enables easy synchronization with other components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the latch can function in various environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature provides reliability in harsh conditions.

Maximum Frequency At Nominal Supply: 200000000 Hz

High maximum frequency capability allows for fast switching and operation in high-speed applications.

Technical Specifications

Latches & Flip-Flops SN74AUC1G79DCKRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC1G79DCKRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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