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SN74AUC1G74DCURE4

Texas Instruments

SN74AUC1G74DCURE4 by Texas Instruments

SN74AUC1G74DCURE4 by Texas Instruments is a latches & flip-flops IC with 3.8 ns propagation delay at 1.2V, suitable for industrial applications. It features a small outline package with very thin profile and shrink pitch, operating b/w -40 to 85°C temperature range. With a max frequency of 200MHz, it offers positive edge trigger type and complementary output polarity for efficient performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 103,650 parts In-Stock

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Vyrian

USA . 7,104 parts In-Stock

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Digiode

USA . 1,884 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$16.856

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Parana Technologies

USA . 1,518 parts In-Stock

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$21.938

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$22.447

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ChromeModa Solutions

Germany . 4,023 parts In-Stock

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$24.649

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$20.212

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IDEA Electronic Components Group

UK . 204 parts In-Stock

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$24.649

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$23.417

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$22.184

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Ampacity Inc.

Singapore . 1,506 parts In-Stock

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$37.000

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One Stop Electronics

USA . 496 parts In-Stock

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Corphita

USA . 3,828 parts In-Stock

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Microchip USA

USA . 1,323 parts In-Stock

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Aranea Global

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DigiPath Technology Company

USA . 959 parts In-Stock

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Overview

Enhance your electronics projects with the SN74AUC1G74DCURE4 by Texas Instruments, a top-quality latches & flip-flops component designed to deliver reliable performance. Texas Instruments is known for its innovative solutions and this product is no exception. With a compact design and low propagation delay, it is perfect for applications where speed and efficiency are crucial. Trust in the value and benefits that this product offers, providing you with precision and accuracy for all your circuit needs. Elevate your projects with Texas Instruments and experience the difference in quality today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the latch durable and resistant to external factors such as moisture and temperature variations.

Propagation Delay At Nominal Supply: 3.8 ns

Fast propagation delay ensures quick response time and efficient operation of the latch.

Surface Mount: YES

Surface mount capability makes installation and integration of the latch easier and more convenient.

Nominal Supply Voltage / Vsup (V): 1.2

Operates efficiently at a low supply voltage, making it energy efficient.

Load Capacitance (CL): 15 pF

Designed to work well with a standard load capacitance, ensuring compatibility with other components.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in controlling the output state of the latch.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures accurate and reliable signal detection for the latch.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the latch reliable and efficient.

Technical Specifications

Latches & Flip-Flops SN74AUC1G74DCURE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

3.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC1G74DCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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