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SN74AUC1G00YEAR

Texas Instruments

SN74AUC1G00YEAR by Texas Instruments

SN74AUC1G00YEAR by Texas Instruments is a logic gate with 2 inputs, 3.2 ns propagation delay, and 5 Amp max I (ol). It operates at temperatures ranging from -40 to 85 °C and has a supply voltage of 1.2/2.5 V. Ideal for industrial applications requiring fast signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,029 parts In-Stock

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3,029

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Digiode

USA . 1,472 parts In-Stock

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1,472

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Distributors (Availability)

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AZTECH Wire

Italy . 436 parts In-Stock

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$7.471

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436

$7.471

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Parana Technologies

USA . 1,340 parts In-Stock

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$30.170

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$67.848

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1,340

$30.170

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$67.848

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DigiPath Technology Company

USA . 1,055 parts In-Stock

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$33.221

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$30.563

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1,055

$33.221

$30.563

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ChromeModa Solutions

Germany . 6,820 parts In-Stock

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$33.899

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$27.797

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6,820

$33.899

$27.797

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IDEA Electronic Components Group

UK . 763 parts In-Stock

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$33.899

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$32.204

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$30.509

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763

$33.899

$32.204

$30.509

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One Stop Electronics

USA . 244 parts In-Stock

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$60.000

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244

$60.000

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Component Stockers USA

USA . 512 parts In-Stock

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$99.990

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512

$99.990

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Perfect Parts

USA . 1,320 parts In-Stock

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Corphita

USA . 874 parts In-Stock

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Microchip USA

USA . 288 parts In-Stock

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Overview

Discover the power of the Texas Instruments SN74AUC1G00YEAR Logic Gate, a high-quality product designed for optimal performance in a wide range of applications. With Texas Instruments’ reputation for excellence in manufacturing, this surface-mount device offers customers reliability and efficiency. With its low power consumption and fast propagation delay, this logic gate provides value by enhancing system performance and reducing energy costs. Perfect for industrial settings, this compact and versatile component is the key to unlocking seamless operation in your electronic projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 2

Having 2 inputs provides flexibility for basic logic operations in a variety of circuits.

Nominal Supply Voltage / Vsup (V): 1.2

The 1.2V supply voltage is common and widely available, making integration into existing systems seamless.

Propagation Delay (tpd): 3.2 ns

The low propagation delay of 3.2 ns ensures fast response and minimal delay in signal processing.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this logic gate is suitable for operation in a wide range of temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate efficient and reliable.

Maximum Supply Voltage (Vsup): 2.7 V

The maximum supply voltage of 2.7V provides flexibility in power supply options while ensuring safe operation.

Technical Specifications

Logic Gates SN74AUC1G00YEAR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-XBGA-B5

Length:

1.4 mm

Logic IC Type:

Maximum I (ol):

5 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA5,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/2.5

Propagation Delay (tpd):

3.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUC1G00YEAR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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