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SN74AS641DWRG4

Texas Instruments

SN74AS641DWRG4 by Texas Instruments

SN74AS641DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.5 ns, suitable for bidirectional control applications. Operating b/w 0 to 70°C, it has a supply voltage range of 4.5V to 5.5V and features open-collector outputs in a small outline package ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,039 parts In-Stock

1+ parts

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4,039

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Digiode

USA . 2,344 parts In-Stock

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2,344

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Distributors (Availability)

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Andel Nordic

Denmark . 4,931 parts In-Stock

1+ parts

$3.102

100+ parts

-

1k+ parts

$2.978

10k+ parts

$2.978

4,931

$3.102

-

$2.978

$2.978

AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$6.832

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570

$6.832

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Parana Technologies

USA . 716 parts In-Stock

1+ parts

$22.855

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-

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$23.516

10k+ parts

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716

$22.855

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$23.516

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DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

$25.166

100+ parts

$23.153

1k+ parts

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1,977

$25.166

$23.153

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ChromeModa Solutions

Germany . 5,812 parts In-Stock

1+ parts

$25.680

100+ parts

$21.058

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-

10k+ parts

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5,812

$25.680

$21.058

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IDEA Electronic Components Group

UK . 364 parts In-Stock

1+ parts

$25.680

100+ parts

$24.396

1k+ parts

$23.112

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364

$25.680

$24.396

$23.112

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One Stop Electronics

USA . 1,464 parts In-Stock

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$45.000

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1,464

$45.000

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Microchip USA

USA . 429 parts In-Stock

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429

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Corphita

USA . 258 parts In-Stock

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258

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Overview

Enhance your electronic design projects with the SN74AS641DWRG4 by Texas Instruments, a high-quality Bus Driver & Transceiver component that boasts reliability and superior performance. With a reputation for excellence in the industry, Texas Instruments delivers cutting-edge technology that meets the demands of various applications. This versatile product offers customers value, efficiency, and precision, making it an essential choice for any project requiring seamless data transmission. Trust Texas Instruments to provide you with the tools you need to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact spaces.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage of 5V ensures compatibility with a wide range of systems and applications.

No. of Terminals: 20

Having 20 terminals allows for versatile connections and configurations, making it suitable for various bus driver and transceiver applications.

Propagation Delay (tpd): 7.5 ns

With a low propagation delay, this product ensures efficient and fast signal transmission, which is crucial in bus driver and transceiver operations.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70°C allows for reliable performance in various environmental conditions.

Output Characteristics: OPEN-COLLECTOR

The open-collector output provides flexibility and compatibility with different types of circuits and systems.

Technology: TTL

Using TTL technology ensures high-speed and reliable signal processing, making this product suitable for demanding bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers SN74AS641DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AS641DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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