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SN74ALVTH16245DL

Texas Instruments

SN74ALVTH16245DL by Texas Instruments

SN74ALVTH16245DL by Texas Instruments is a Bus Driver & Transceiver with 3.6 ns Propagation Delay, 2.5V Nominal Voltage, and 48 Terminals. It is used for bidirectional data transmission in industrial applications requiring fast signal propagation and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 26,266 parts In-Stock

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Vyrian

USA . 7,197 parts In-Stock

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Digiode

USA . 1,901 parts In-Stock

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1,901

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Chip Stock

USA . 181 parts In-Stock

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Connect4Technologies Inc.

Canada . 175 parts In-Stock

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175

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Electronics Depot

USA . 48 parts In-Stock

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48

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EMSNET

USA . 7 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 238 parts In-Stock

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$7.407

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238

$7.407

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Parana Technologies

USA . 902 parts In-Stock

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$14.855

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$15.286

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902

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$15.286

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DigiPath Technology Company

USA . 1,644 parts In-Stock

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$16.357

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ChromeModa Solutions

Germany . 3,564 parts In-Stock

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$16.691

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$13.687

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3,564

$16.691

$13.687

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IDEA Electronic Components Group

UK . 1,996 parts In-Stock

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$16.691

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$15.856

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$15.022

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1,996

$16.691

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One Stop Electronics

USA . 1,410 parts In-Stock

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$48.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 711 parts In-Stock

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Microchip USA

USA . 311 parts In-Stock

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311

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Overview

Unlock seamless data transmission with the SN74ALVTH16245DL by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. As a leading Bus Driver & Transceiver, this versatile component offers rapid propagation delays and an array of practical applications. Experience enhanced performance, efficiency, and precision in your projects with the unmatched value and benefits that this product provides. Elevate your designs with Texas Instruments' cutting-edge technology and trust in the excellence of the SN74ALVTH16245DL for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for transportation and handling in a bus driver/transceiver application.

Propagation Delay At Nominal Supply: 3.6 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed communication requirements in buses.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly in bus driver/transceiver systems.

No. of Functions: 2

Having multiple functions in a single component provides versatility and efficiency in bus driver/transceiver applications, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly used in bus systems, ensuring compatibility and reliable operation in various bus driver/transceiver setups.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures proper signal integrity and stability, essential for the reliable performance of the bus driver/transceiver.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this product is suitable for bus environments that may experience varying temperature conditions.

Technical Specifications

Bus Driver & Transceivers SN74ALVTH16245DL attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74ALVTH16245DL Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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