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SN74ALS32NSRG4

Texas Instruments

SN74ALS32NSRG4 by Texas Instruments

SN74ALS32NSRG4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 12 ns at 5V, making it suitable for high-speed applications. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,997 parts In-Stock

1+ parts

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7,997

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Digiode

USA . 3,103 parts In-Stock

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-

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3,103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$5.641

100+ parts

-

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445

$5.641

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Parana Technologies

USA . 455 parts In-Stock

1+ parts

$15.119

100+ parts

-

1k+ parts

$15.523

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455

$15.119

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$15.523

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DigiPath Technology Company

USA . 337 parts In-Stock

1+ parts

$16.648

100+ parts

-

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337

$16.648

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ChromeModa Solutions

Germany . 3,432 parts In-Stock

1+ parts

$16.988

100+ parts

$13.930

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-

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3,432

$16.988

$13.930

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IDEA Electronic Components Group

UK . 1,195 parts In-Stock

1+ parts

$16.988

100+ parts

$16.139

1k+ parts

$15.289

10k+ parts

-

1,195

$16.988

$16.139

$15.289

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One Stop Electronics

USA . 1,006 parts In-Stock

1+ parts

$65.000

100+ parts

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1,006

$65.000

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Microchip USA

USA . 2,284 parts In-Stock

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2,284

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Corphita

USA . 1,616 parts In-Stock

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1,616

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Overview

Enhance your electronic projects with the SN74ALS32NSRG4 by Texas Instruments, a high-quality logic gate that delivers reliable performance and precision engineering. Manufactured by Texas Instruments, a trusted leader in the semiconductor industry, this versatile component is perfect for a wide range of applications. With its fast propagation delay and low power consumption, the SN74ALS32NSRG4 offers exceptional value and efficiency. Upgrade your designs today with this top-of-the-line logic gate and experience the advantages of cutting-edge technology combined with unparalleled reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring long-lasting performance and easy handling.

Propagation Delay At Nominal Supply: 14 ns

Fast propagation delay at nominal supply voltage, promoting efficient operation and quick response in logic operations.

Surface Mount: YES

Convenient surface mount option for easy PCB assembly, saving time and effort during installation.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage support of 5V, making it compatible with a wide range of electronic systems and circuits.

Power Supplies (V): 5

Consistent power supply support at 5V, ensuring stable and reliable performance under various operating conditions.

Technology: TTL

Utilizing TTL technology for reliable logic gate operation, offering high noise immunity and robust signal processing capabilities.

Maximum Operating Temperature: 70 °C

Wide operating temperature range of up to 70°C, suitable for diverse environmental conditions and applications.

Technical Specifications

Logic Gates SN74ALS32NSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

4.9 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ALS32NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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