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SN74ALS05ADRG4

Texas Instruments

SN74ALS05ADRG4 by Texas Instruments

SN74ALS05ADRG4 by Texas Instruments is a TTL logic gate with 6 functions, 54 ns propagation delay at 5V. It has open-collector output and operates b/w 0-70°C. Ideal for applications requiring fast signal processing in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,110 parts In-Stock

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Digiode

USA . 2,760 parts In-Stock

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2,760

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Bristol Electronics

USA . 1,113 parts In-Stock

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Dan-Mar Components

USA . 1,113 parts In-Stock

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1,113

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Distributors (Availability)

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AZTECH Wire

Italy . 468 parts In-Stock

1+ parts

$13.459

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468

$13.459

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Parana Technologies

USA . 771 parts In-Stock

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$25.862

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$26.459

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771

$25.862

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$26.459

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DigiPath Technology Company

USA . 365 parts In-Stock

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$28.477

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$26.199

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365

$28.477

$26.199

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IDEA Electronic Components Group

UK . 2,219 parts In-Stock

1+ parts

$29.058

100+ parts

$27.605

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$26.152

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2,219

$29.058

$27.605

$26.152

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ChromeModa Solutions

Germany . 642 parts In-Stock

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$29.058

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$23.828

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642

$29.058

$23.828

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One Stop Electronics

USA . 743 parts In-Stock

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$45.000

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743

$45.000

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Corphita

USA . 2,080 parts In-Stock

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Microchip USA

USA . 108 parts In-Stock

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Overview

Elevate your projects with the SN74ALS05ADRG4 logic gate by Texas Instruments. Crafted with precision and expertise, this high-quality component is designed to enhance performance in a wide range of applications. With its advanced features and reliable functionality, this product offers exceptional value and benefits to customers looking for superior logic gate solutions. Trust Texas Instruments to deliver excellence with every component, ensuring optimal results for your projects. Choose the SN74ALS05ADRG4 for quality you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 54 ns

Low propagation delay ensures fast and efficient operation for the logic gates.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used 5V supply voltage, making it compatible with many existing systems.

Maximum I (ol): 8 Amp

High output current capability allows the logic gates to drive larger loads without any issues.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other components, providing flexibility in design.

Technology: TTL

Using TTL technology ensures reliability and compatibility with other TTL components in the system.

Technical Specifications

Logic Gates SN74ALS05ADRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

4.2 mA

Propagation Delay At Nominal Supply:

54 ns

Propagation Delay (tpd):

54 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74ALS05ADRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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