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SN74AHCT273DGVRE4

Texas Instruments

SN74AHCT273DGVRE4 by Texas Instruments

SN74AHCT273DGVRE4 by Texas Instruments is an 8-bit latch with a supply voltage of 5V, operating temperature range of -40 to 85°C, and propagation delay of 11ns. It is ideal for industrial applications requiring positive edge triggering and a max frequency of 45MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,893 parts In-Stock

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Digiode

USA . 1,184 parts In-Stock

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AZTECH Wire

Italy . 446 parts In-Stock

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$7.554

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446

$7.554

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Parana Technologies

USA . 1,899 parts In-Stock

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$23.860

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$24.492

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$23.860

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DigiPath Technology Company

USA . 1,946 parts In-Stock

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$26.273

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$24.171

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IDEA Electronic Components Group

UK . 1,628 parts In-Stock

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$26.809

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$25.469

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$24.128

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$26.809

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$24.128

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ChromeModa Solutions

Germany . 568 parts In-Stock

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$26.809

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$21.983

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568

$26.809

$21.983

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One Stop Electronics

USA . 1,281 parts In-Stock

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$29.000

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Component Stockers USA

USA . 586 parts In-Stock

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$99.990

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Corphita

USA . 3,800 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless data storage and retrieval with the Texas Instruments SN74AHCT273DGVRE4 latch flip-flop. Crafted with precision and expertise, this innovative product offers reliable performance and durability for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile component ensures smooth operations and efficient functionality. Trust in Texas Instruments to deliver quality and value with every product, setting the standard for excellence in the industry. Elevate your projects with the SN74AHCT273DGVRE4 and experience unmatched performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-lasting performance.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 8

Suitable for applications requiring 8 bits of data storage or processing, providing flexibility and functionality.

Propagation Delay (tpd): 11 ns

Low propagation delay ensures fast response times, making this latch or flip-flop ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

Capable of operating in a wide range of temperatures, including industrial environments, ensuring reliable performance under varying conditions.

Maximum Frequency At Nominal Supply: 45000000 Hz

Provides high-frequency operation, making it suitable for applications requiring rapid data processing and response times.

Technical Specifications

Latches & Flip-Flops SN74AHCT273DGVRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

65 MHz

Trade Compliance

SN74AHCT273DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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